Wednesday, November 27, 2019

Telecommunication Industry free essay sample

In the old days, the telecom industry was viewed as an example of â€Å"natural monopoly. † This was due to increasing returns to scale, where the telecom services could only be provided efficiently by a monopoly provider. In the U. S. , this pattern started many years ago when the American Bell Telephone purchased the Western Electric Company of Chicago. Alexander Graham Bell patented the telephone in 1876 and formed Bell Telephone. ATT, which is today one of the leading company in the wireless telecommunication industry, was formed in 1885 to connect the Bell Companies. In 1913, ATT agreed to become a regulated monopoly. Although their monopoly was allowed, they were required to connect competing local companies and let the Federal Communication Commission to approve their prices and policies. In January of 1982, ATT agreed to break itself into a national long-distance carrier and seven â€Å"baby bells† in order to end the long-running antitrust suit by the U. We will write a custom essay sample on Telecommunication Industry or any similar topic specifically for you Do Not WasteYour Time HIRE WRITER Only 13.90 / page S. Department of Justice. The break occurred in 1984. At the time of the breakup of ATT, almost all telephone companies were monopolies and the increased growth toward competition The cost reductions have made access to the Internet affordable to the general public. However, in the wireless market, while more people are able to get new devices, companies may try to cap their data usage. For example, at Verizon, they changed their data plans from unlimited usage to capped plans. This is â€Å"partially due to rising bandwidth costs from data-hungry subscribe, making the switch to tiered plans inevitable. Network expansion is another area of the wireless sector that can lead to transactions costs. A good example is Sprint plans to expand its network from the WiMax to the LTE, which is expected to take place in 2013. All main competitors already are into the LTE network. This switch â€Å"is expected to cost Sprint $4 and $5 billion, though the investment could deliver over twice that in economic benefit to the company, if this bet pays off better than the money it put on WiMax did. † Through this example we can see how there are most than just the cost of expanding the network itself, but anything else that is involved until its completion.

Sunday, November 24, 2019

How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essays

How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essays How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essay How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essay If is greater with impact time being constant, the average must be greater. When temperature of the squash ball is low, it is quite soft and easy to be deformed. The impact time is hypothesized to be longer. As temperature increases, the squash ball will become more rigid and deform less. The impact time is hypothesized to be shorter. Since, when the impact time is smaller with net force being constant, the average force must be greater. Therefore, with the two effects, the average force of the impact is hypothesized to be greater when temperature increases.Method and materials.Experiment (a)Since there is originally no any equipment that can measure the extremely short impact time, therefore I had to develop several ideas to measure the time. These are the six possible solutions:1. Stroboscopic photosThe negative is put under long exposure. And the experiment is supposed to be performed in a dark room otherwise the negative will be over expose. Stroboscope is needed to give the flas hes at a very high frequency. Under which, the images of the falling ball including the impacting period will be taken. We will then count the numbers of images that are touching the ground (impact period). With the frequency shown on the stroboscope, we can then calculate the impact time of the squash ball.However there is limitation of the experiment. The impacting images may pack too close to each other that we cannot distinguish the number of them and fail to calculate the correct value.Moreover stroboscopic photos are difficult to be taken well. It requires skill to control the exposure so that the photos taken will not be too bright or too dark for observation. Therefore the suggestion was abandoned.2. Ultrasonic position sensor (UPS)Place a UPS on the ground; drop the ball from certain height to it. The UPS is connected to a computer for receiving data. A graph of distance against time will be plotted automatically. By observing the length of time when the distance is at zero , we can know the impact time of the ball.However, later I acknowledged that the speed of the ultrasonic waves is not fast enough to measure the fast dropping object to give accurate results. Therefore the suggestion was abandoned.3. Conduction sensorFix a piece of foil on a dense plate (cutting board), on the surface place another piece of foil closely but without touching the first one. Both foils are connected to a scalar timer with wires. The ball is then dropped onto the upper foil, pressing the foil and closing the circuit. When the ball rebounds, the upper foil releases and disconnects the circuit. The impact time can be indirectly collected from the conduction time. As this experiment was easier to perform, I used the set up to find a rough impact time of about 0.01s~0.05s. This result can be then used as a assumption value for other suggestion.However, it was suggested that the upper foil may obstruct the falling speed of the ball. This leads to an experimental error of the results. Moreover after the ball rebounds and leaves the upper foil, the foil may still in touch with the lower foil due to deformation. The impact time we get may be over estimated.4. Light sensorSet up a light sensor on the table with the light beam just situate above the table surface. Then drop the ball to cut the beam. The time that the light sensor obtains is the impact time.However, as the light beam has finite thickness, it is not accurate enough to measure the impact time. The ball may cut the beam too early and leave too late which over estimate the impact time. Furthermore, it is difficult to ensure the ball drop exactly to the light beam by its lowest point. The results may not be accurate.5. Formula and calculationFirst we need to measure the dropping height, e.g. A cm. Then we drop the ball and at the same time start to count the time using a timer. When the ball rebounds to the highest point we stop the timer and at the same time record the highest point it reaches, e.g. B cm. let the total time for the process be C seconds. From the formula s=ut +(1/2) at2. We then substitute distances B and C to find out the time need for dropping and rebounding.But deficiencies are still being found for this alternative. There is reaction time error in working the timer. The reaction error is even larger than the impact time. Also, the highest point the ball reaches may not be accurately detected. So the measurement is considered not working.6. Digital-video camera approachUse the camera to take the impacting images of the ball. Then replay the film to find out the time of impact. As we found out that the impact time is around 0.03Final decisionAfter series of consideration, I made the final choice to use the option 3. Despite its limitation that may lead to over estimation of results, I found the problems that may occur in No.3 least essential. Moreover stretching the upper foil a little can reduce the deformation of the upper foil. So this measuring method was selected.Experimental set up.In the experiment I prepared the following material for the setting up.MaterialsKettle, clamp, chopsticks, squash balls, stand, towel, scalar timer, aluminium foil, aluminium tape, plastic tape, wire, clips, cutting board, a pack of unused paper card.MethodsFirst of all, Impact Time Measuring Device (ITMD) was made as core of the set up:Aluminium foil was stuck to the cutting board until its upper surface was completely filled up by the tape. I then check the conduction of the foil to ensure no gaps between each strip of tape. Then an 8x8cm2 hole was made from 10x10cm2 paper card. A piece of 8x9cm2 foil was then stretched on the middle of the hole. Then I used tape to fix the foil on two ends of the hole. The paper card with the foil on top was put onto the upper surface (with foil) of the cutting without the two piece of aluminium touching each other. Then both foils were connected to two separated wires with crocodile clips and the wires were conn ected to the scalar timer. The ITMD was finished.In order to test if the ITMD was reliable, I performed several dropping test for checking. Firstly I dropped the ball at room temperature of height 140 cm; unfortunately the results each time collected were not consistent. They had differences of about 50% to 200%. Therefore I changed the setting of the paper card. I used a larger piece of foil (99 cm2) and stretched it to the four end of the paper hole. The later tests showed improvement as the differences drop to about 20% to 60%. And I thought that it may due the deformation of foil that the two foils still pressed to each other when the ball left. So I stuck another piece of paper card with hole just right beneath the original one. It was done to increase the distance between the two foils by about 0.5mm so that they are more likely to separate after the ball has left. The tests followed were more coherent as their differences were just about 10 % to 20%. Then I varies the droppin g height to see if the measurer could detect the time different (room temperature). It showed an increasing trend of impact time when the dropping height increase. That proved that it senses changes.The kettle was then used to boil the water for heating up squash balls; however it is not convenient to do in this way, so I changed to use a water bath instead. With the water bath, I could then adjust the temperature I want easily. Clamps were used to release the balls instead of the chopsticks. Firstly stand with clamp were put on the lab table. I measured 130 cm from the bottom of the ball in the clamp vertically to the centre of the cutting board. Then the squash balls were first immersed into water of 20.2oC for 10 minutes to ensure the balls were have same temperature as water. Then I used the clamp to take one from the water bath, quickly dried it with towel and transferred to the clamp on the stand, released it to the centre of the paper. Then I repeated the procedure by another nine times to collect ten data at that temperature. In between, I recorded the impact time from the scalar timer. After that I continued the experiment with an increase of 10 oC until it reached 100 oC. For the handling of hot balls, working gloves were needed.Experiment (b)MaterialsClamp, squash balls, stand, towel, scalar timer, aluminium foil, aluminium tape, plastic tape, wire, clips, cutting board, a pack of unused paper card, water bath, working gloves.1. Same platform (cutting board with paper card) in experiment (b) was used to make the condition of two experiments more constant. Pieces of blank papers were first placed along the drop ping track of the ball on the side of the lab table. The balls were taken from the water bath of the temperatures as Experiment (b), dried, transferred to clamp and dropped to the cutting board quickly. The highest points it reached after the rebound were marked onto the papers. I repeated ten times for each temperature. Finally measuring tape was used to measure the rebound height of each temperature.Data CollectionDropping Height=130.0 + 0.1cm1. Temperature=20.2 + 0.4 o CTrial12345678910MeanRebound height/cm1818.218.218.418.418.418.618.8191918.5+0.2Impact time/0.001s191920202020212224240.0209Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (18+18.22+18.43+18.6+18.8+192)/10 = 18.5 cm + 0.2cmUncertainty =Mean impact time =Uncertainty =2. Temperature=30.0+0.4oCTrial12345678910MeanRebound height/cm27.227.427.427.427.827.828.428.428.628.627.9Impact time/0.001s161920202021222324240.0209Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (27.2+27.43+27.82+28.42+28.62)/10 = 27.9 + 0.2 cmUncertainty =Mean impact time = (20.9 + 1.3) 10-3sUncertainty =3. Temperature = 40.0+ 0.4oCTrial12345678910MeanRebound height/cm35.835.836.336.436.436.436.436.436.636.836.3Impact time/0.001s1719202121212222232421Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (35.82+36.3+36.45+36.6+36.8)/10 = 36.3+0.2cmUncertainty =Mean impact time =( 21+1.1) 10-3sUncertainty =4. Temperature = 50.0+0.4oCTrial12345678910MeanRebound height/cm4144.644.844.844.844.8454545.445.644.6Impact time/0.001s1819191920212223232420.8Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (41.0+44.6+44.84+45.02+45.4+45.6)/10 = 44.6+ 0.7cmUncertainty =Mean impact time = (20.8+0.9) 10-3sUncertainty =Trial12345678910MeanRebound height/cm51.651.851.8525252.252.252.652.65452.3Impact time/0.001s1719192021212121222320.45. Temperature = 60.0+0.4oCUncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (51.6+51.82+522+52.22+52.62+54)/10 = 52.3+0.4cmUncertainty =Mean impact time = average time = (20.4+0.9) 10-3sUncertainty =6. Temperature = 70.0+0.4 oCTrial12345678910MeanRebound height/cm60.460.660.661.661.861.862.662.662.863.261.8Impact time/0.001s1619192020202121222420.2Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (60.4+60.62+61.6+61.8+62.62+62.8+63.2)/10=61.8+0. 4cmUncertainty =Mean impact time= average time = (20.2+1.3) 10-3sUncertainty =7. Temperature = 80.0+0.4 oCTrial12345678910MeanRebound height/cm6868.869.269.269.870.670.871.672.673.670.4Impact time/0.001s1717182121212222232320.5Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (68.0+68.8+69.2+69.8+70.6+70.8+71.6+72.6+73.6)/10 = 70.4+0.9cmUncertainty =Mean impact time = average time =( 20.5+0.8) 10-3sUncertainty =8. Temperature = 90.0+0.4 oCTrial12345678910MeanRebound height/cm74.674.876.8777777.677.877.878.478.877.1Impact time/0.001s161920202021212223251.4Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (74.6+74.8+76.8+772+77.6+77.8+78.4+78.8)/10 = 77.1+0.7cmUncertainty =Mean impact time = average time = (20.7+1.4) 10-3sUncertainty =9. Temperature = 100.0+0.4 o CTrial12345678910MeanRebound height/cm8080.880.881.48282.682.882.883.48482.1Impact time/0.001s1920202020232121212521Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (80.0 +80.82+81.4+82+82.6+82.82+83.4+84)/10 = 82.1+0.6cmUncertainty =Mean impact time = average time =(21+0.9) 10-3sUncertainty =ObservationThe size of the squash ball increased as temperature increased.At high temperatures ;80 oC, the surface of the squash ball became rough as some of the rubber skin of the squash ball was boil away.AnalysisThe impact time against the temperature:Unlike my hypothesis, the result of the impact time of the ball showed no obvious change when temperature increased. Moreover the pattern of the trend was not the way I thought where it was hypothesized to increase as temperature increase.The graph of rebound height against temperature:The rebound height showed obvious increase as temperature. The results fit with the hypothesis. The rate of increase of rebound height was quite constant from temperature 20 o C to 80 o C. Then it started to decrease from temperature 80 o C to 100 o C.At the time of impact, the force diagram of the ball is like this:There were two forces acting on the ball, one is the normal force acted by the ground, the other one is the gravitational force acted by the earth. Since net force of the ball, therefore the force acted by the groundTemperature of squash ball / o C20.230405060708090100Average force acted on the squash ball by the ground /N7.98.48.79.19.59.910.110.210.2From the graph of force acted on the ball against temperature. I found that the highest increase rate of force occurring at temperature at around 20-30o C, high increase rate continued from 20-65 o C. The rate of increase slowly decreased as it approached temperature greater than 70 o C and finally showed no change around 100 o C. By drawing a line of symmetry from the top of the trend line, we could observe that the highest average force the ground acting on the ball to be about 10.2N.DiscussionAverage forceAs stated , the graph showed a maximum average of ~10.2N. It suggested that if the velocity of the squash ball is hold constant, the average fo rce that can be exerted to a squash ball by a stationary impacting surface will be at maximum when temperature around 95o C.However the average force will not drop to zero when temperature drops to absolute zero. Since the average force acted on the ball by the ground , it is always ;0 because the velocity of the ball is changing. According to the Newtons first law of motion, every body continues on it state of rest of uniform speed in a straight line unless acted on by a nonzero force. At the point of impact, the ball accelerates upward. The only force that points upward is the normal force by the ground. Although there may be a possibility that the ball drops and sticks to the ground at extreme low temperature, causing the ?t to be infinite, but still there is the opposing force acts by the ground again the weight of the ball. So the average force by the ground must at least equal to 9.810.023 which is ~0.23N.In addition, the rate of increase of average force acted by the ground i s believed to fall at the lower temperature. As shown in the graph above, the trend line is pointing toward zero at temperature-273. We have explained that the trend will not be zero even when the temperature is -273. One possible way will be a turning point located somewhere between -273 to 20o C. And if there is a turning at that certain point, the rate of increase must be lower at that point.Rebound heightThe rate of increase of rebound is quite constant until at 80 o C it decreased. Theoretically the trend line will approach 130cm when temperature goes to infinity. However it is not possible because squash ball will melt at high temperature. For the low extreme, the squash may not rebound properly as the low temperature may constrict the plastic layer of squash ball, making it deforms, losing it quality. It is just a prediction and is difficult to perform in the school lab.Impact timeThe impact time showed no relation with the range of temperature set for experiment. The set up may not be sensitive to sense the different.Relation of force and energy at the impactThe potential energy of the ball was changed to kinetic energy before the impact; some of the energy was lost to the air friction. At the impact, some of the kinetic energy was transferred to heat energy of the ground and the ball. Some of it was transferred to the sound energy. It lost his energy and rebounded to a lower height. Those energy did lose in the impact was transferred to build up the shear modulus (elastic energy) of the ball. The greater the elastic energy is the higher the ball rebound.Evaluation of the experimentThe experiment was considered successful as the data showed a direct relationship between average force and temperature of the squash ball and a decreasing rate of increase of average force when the temperature increases. However the impact times collected were about the same which contradicted to my hypothesis. They were not even in sequence. That may due to the deficiency of the experimental set up. The foils might still connect together a short time after the ball had left. Although the time is short compared to the impact time, it changed for every impact. Therefore the impact time I got was not in a trend but about the length. it may also due to the insensitivity of the set up. After all I still managed to get the approximate impact time for the calculation of average force.For the rebound height experiment, it was quite good. There was little problem such as the imprecise way of recording rebounding height by using eye observation.On the whole, there were many systematic errors in both experiments that may affect the results. For examples, the size of the ball increased as temperature increased, it might have increased the impact time of the ball due to larger impacting area. It was possible to be the reasons for the unsuccessful for the impact time results. This might also affect the rebound height of the experiment.The foil on the cutting board reduced the velocity before impact. It might have reduced the rebound height and the impact time of the ball. The average force might have been over estimated or under estimated depends on the extent of reduction of the rebound height and impact time.Heat lost rate increased as temperature of ball increased. That suggested that the rebound height should be at the lower temperature. The rebound heights were over estimated for the higher temperature. The impact times were also affected in a certain degree.ImprovementRenew the upper foil whenever it deforms to avoid over estimation of impact time. However it may be inconvenient.Change to another method in measuring the impact time. e.g. light sensor.For the measuring of the rebound height, we can ask a partner to observe the rebound ball at the same level to improve accuracy. We can also do more repetitions for more data.Drop the squash balls directly without transferring them to the clamp on the stand. However high delicacy is need t o ensure the dropping height is right and not initial force is applied to the ball.ConclusionThe results of the experiment stated that there are changes of average force acted on the ball by the impact surface with the velocity of ball hold constant. The maximum average force will be reached at temperature around 95oC. This proved that the hypothesis to be true. However the hypothesis for the impact time was not proven to be true as the set up was appropriate enough to measure the data accurately.Nevertheless, the result still showed the rate of increase in average force of impact at different. By using the data we can know that at what temperature does the squash ball work most effectively with the smallest force given. The data can also be useful for the manufacture of squash ball.

Thursday, November 21, 2019

Entrprise resource planning Essay Example | Topics and Well Written Essays - 500 words

Entrprise resource planning - Essay Example It also helps maintaining adequate inventory levels within the organization. There are three primary factors or influencers in aggregate forecast accuracy include regulation changes, economic conditions and analyst characteristics changes. 2. Explain the Outsourcing Decision process used by the major US Automotive OEMs in Shedding most component manufacturing (e.g. Delphi, Visteon), while maintaining Most Metal Stamping and Powertrain Manufacturing. Outsourcing remains firmly entrenched in the business. Therefore, companies mostly focus on the significance of the decision-making process during outsourcing. By engaging in the Outsourcing Decision Process, most US Automotive OEMs aim at increasing efficiency and saving costs in shedding component manufacturing during powertrain manufacturing and metal stamping. In doing the decision process, most OEMs tend to use the Outsourcing Decision matrix, which entails the operational performance. The processes, in this case, include forming a strategic alliance, retaining, and outsourcing. On the other hand, using the matrix tool entails first identifying the tasks strategic importance, identifying the contribution of the operational performance and plotting the automotive OEMs tasks on the matrix. A more detailed insight in reference to outsourcing decision process used by most automotive OEMs includes preparing, selecting the vendor, transition, managing relationship and reconsideration. During the preparation phase, the automotive OEMs engage in sourcing options, strategies, and the configuration activities. On the other hand, during the selection of the vendor, most automotive companies do the negotiation after choosing the vendor. The transition process entails defining the communication and knowledge exchange. It also entails assets, people and information transfer. Managing relationship, in this case, entails ensuring that the relationships last thus management of the success

Wednesday, November 20, 2019

Psychology, Sleep Theories Research Paper Example | Topics and Well Written Essays - 500 words

Psychology, Sleep Theories - Research Paper Example While asleep, most physiological functions of an individual such as blood pressure, heartbeat and rate of breathing decrease. It has been proved that in human beings, mammals, and a majority of other animals regular sleep is necessary in order to survive. Sleep is not a uniform process. Sleep happens in progressive stages, referred to as the sleep cycle (Tami Port, 2009).These stages show characteristic changes in the activity of brain. The cycle begins with light sleep, followed by deep sleep. Sleep is divided into two main stages, REM sleep and non-REM sleep. Here REM stands for "rapid eye movement". Non-REM sleep can be again divided into four stages. As sleep progresses from stage one to stage four, sleep becomes deeper. The third and fourth stages are often grouped together and are called slow wave sleep (SWS). When an individual is in SWS muscle and eye movements become less. Even though human beings spend almost one-third of their lives sleeping, one does not know exactly the functions of sleep. One of the major theories of sleep says that sleep is necessary for repair and restoration of the body as well as the mind. According to this theory sleep helps the body recover after an active day and gives the body the chance to restore substances that are lost while performing our daily duties. Another theory suggests that sleep has an adaptive function. According to this theory animals sleep because they need to protect themselves. However it is a known fact that sleep is a time to rest and rejuvenate and that it benefits us in many ways. When a person does not get the required amount of sleep he feels drowsy all the time, is not able to concentrate and is irritable .It has been proved that REM sleep is important for learning and memory. Many individuals complain of lack of or insufficient sleep. All of us at some time or the other have experienced this. However for many this problem is severe and

Sunday, November 17, 2019

Stem Cell Therapy Essay Example | Topics and Well Written Essays - 500 words

Stem Cell Therapy - Essay Example Some stem cell researchers have advocated for the therapy in treating diseases like diabetes mellitus, Parkinson’s disease, ulcerative colitis, Duchenne muscular dystrophy, multiple sclerosis and other myopathy, hematopoietic organ diseases, oncological diseases, some hereditary and genetic abnormalities (Conrad, 2012). Some success rates in stem cell therapy exist in the field of oncology where cancer patients subjected to chemoprophylaxis may at one point require bone marrow transplantation or umbilical blood stem cells. Chemoprophylaxis in cancer patients often results in the destruction of cancer cells plus even hematopoietic cells. Stem cell often helps them in restoring their normal blood cells increasing their chances of survival from the disease. Therapeutic cloning is a type of stem cell therapy. Cloning is possible through the use of embryonic stem cells. Here, an egg gets denucleated, that is, the DNA gets removed, and replaced with a somatic cell nucleus. The egg gets stimulated through the use of an electric pulse, and a blastocyst gets formed to provide stem cells that are identical to those of the original somatic cell nucleus. If implanted in the womb, the replicated embryo can be born as a cloned baby. It is through this process that Dolly the first cloned sheep was created (Conrad, 2012). Embryonic stem cell suitability for transplantation has recently been in question because of the instability of the cloned cells. Dolly, for example, gave an outward impression of full health but had many genetic defections (Wimmer 3). The process of therapeutic cloning is ineffective. A high percentage of clones die before or soon after birth with a success rate of between 3 to 4% (Conrad 2012). In as much as there have been a number of progresses in stem cell therapy, there are still a number of controversies regarding the issue. Controversies

Friday, November 15, 2019

Desmear and electroless plating

Desmear and electroless plating Introduction Printed circuit board is used in the electronic manufacturing for mechanical and electrical support. It is electronically connects the electric components using conductive traces, carved from copper covered onto a non-conductive material. Printed circuit board are usually include copper and copper mixture materials that are coated to provide good mechanical and good conductivity with other devices in the assembly. Printed circuits board are used in all electronic equipments such as computer and mobile phones and TV and communications equipment and satellite as well as in the control of gadgets in the factories, companies and other uses of the innumerable à Ã‚ t thà Ã‚ µ mà Ã‚ ¾mà Ã‚ µnt thà Ã‚ µrà Ã‚ µ iц¢  ° ц¢trà Ã‚ ¾ng inÑ rà Ã‚ µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ in thà Ã‚ µ dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢irà Ã‚ µ fà Ã‚ ¾r jà Ã‚ ¾int bà Ã‚ µnding  °nd jà Ã‚ ¾int bà Ã‚ µnding-rigid and light à Ã‚  Ãƒ Ã‚ ¡Bц¢ duà Ã‚ µ tà Ã‚ ¾ Ñ Ãƒ Ã‚ µrt °in m °rkà Ã‚ µt ц¢Ãƒ Ã‚ µÃƒâ€˜Ã‚ tà Ã‚ ¾rц¢. Thà Ã‚ µ inÑ rà Ã‚ µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µd tà Ã‚ µÃƒâ€˜Ã‚ hnà Ã‚ ¾là Ã‚ ¾giÑ Ã‚ °l dà Ã‚ µm °ndц¢ frà Ã‚ ¾m thà Ã‚ µ l °tà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢t h °ndhà Ã‚ µld dà Ã‚ µviÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nt °ining Digital Ñ Ã‚ °mà Ã‚ µr °Ãƒâ€˜Ã¢â‚¬ ¢  °nd nà Ã‚ µw high TV rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ ¾lutià Ã‚ ¾n ц¢Ãƒâ€˜Ã‚ rà Ã‚ µÃƒ Ã‚ µnц¢  °Ãƒâ€˜Ã¢â‚¬ ¢ wà Ã‚ µll  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ nà Ã‚ µwà Ã‚ µr mà Ã‚ ¾bilà Ã‚ µ Ñâ‚ ¬hà   ¾nà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ mà Ã‚ µÃ‚ °nц¢ th °t thà Ã‚ µrà Ã‚ µ iц¢  ° ц¢urgà Ã‚ µ in thà Ã‚ µ rà Ã‚ µquirà Ã‚ µmà Ã‚ µnt fà Ã‚ ¾r jà Ã‚ ¾int bà Ã‚ µnding-rigid Ñâ‚ ¬Ã‚ °nà Ã‚ µlц¢  °nd multi-jà Ã‚ ¾int bà Ã‚ µnding Ñâ‚ ¬Ã‚ °nà Ã‚ µlц¢. Thà Ã‚ µ nà Ã‚ µÃƒ Ã‚ µd tà Ã‚ ¾ m °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬rà Ã‚ ¾duÑ Ãƒ Ã‚ µ thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ Ñâ‚ ¬Ã‚ °nà Ã‚ µl tyÑâ‚ ¬Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °nd tà Ã‚ ¾ rà Ã‚ µduÑ Ãƒ Ã‚ µ thà Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢t à Ã‚ ¾f m °nuf °Ãƒâ€˜Ã‚ turà Ã‚ µ,  °Ãƒâ€˜Ã¢â‚¬ ¢  °lw °yц¢ h °Ãƒâ€˜Ã¢â‚¬ ¢ drivà Ã‚ µn thà Ã‚ µ dà Ã‚ µvà Ã‚ µlà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬mà Ã‚ µnt à Ã‚ ¾f nà Ã‚ µwà Ã‚ µr mà Ã‚ µthà Ã‚ ¾dц¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ing. (à Ã¢â‚¬ ¦Ãƒâ€˜Ã‚ hlà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ingà   µr, 2002, 82) Tà Ã‚ µÃƒâ€˜Ã‚ hniÑ Ã‚ °lly thà Ã‚ µ m °tà Ã‚ µri °lц¢ invà Ã‚ ¾lvà Ã‚ µd in jà Ã‚ ¾int bà Ã‚ µnding / jà Ã‚ ¾int bà Ã‚ µnding-rigid PCB bà Ã‚ ¾Ã‚ °rd m °nuf °Ãƒâ€˜Ã‚ turing gà Ã‚ µnà Ã‚ µr °tà Ã‚ µ  ° l °rgà Ã‚ µ numbà Ã‚ µr à Ã‚ ¾f iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢. à Ã… ¾nà Ã‚ µ kà Ã‚ µy Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µrn iц¢ thà Ã‚ µ l °rgà Ã‚ µ use v °ri °nÑ Ãƒ Ã‚ µ à Ã‚ ¾f m °tà Ã‚ µri °lц¢ in à Ã‚ ¾nà Ã‚ µ bà Ã‚ ¾Ã‚ °rd build-uÑâ‚ ¬  °Ãƒâ€˜Ã¢â‚¬ ¢ wà Ã‚ µll  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ à Ã‚ µxà Ã‚ ¾tiÑ  n °turà Ã‚ µ à Ã‚ ¾f ц¢Ãƒ Ã‚ ¾mà Ã‚ µ à Ã‚ ¾f thà Ã‚ µ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾nly uц¢Ãƒ Ã‚ µd m °tà Ã‚ µri °lц¢, water consupmition  °nd thà Ã‚ µ inhà Ã‚ µrà Ã‚ µnt iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µy r °iц¢Ãƒ Ã‚ µ. (à Ã¢â ‚¬ ¦Ãƒâ€˜Ã‚ hlà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ingà Ã‚ µr, 2002, 82) PCB are inexpensive, and can be highly reliable. They require much more design effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits, but are much cheaper and faster for high-volume production. Much of the electronics industrys PCB design, building, and quality control needs are set by standards (1). In 1885 before the appearance of electric circuit board and point to point production, plate of carton was used to connect the electric components with wires and it was heavy and has big volume. Before printed circuits point-to-point production was used for primary sample or small production runs wire. Circuit boards were produced in the mid-1930, by Austrian inventor Paul Eisler. During World War II the United States produced them on a huge range for use in war radios. During this period the invention remained use in the military part, and until the end of the war it became available for commercial use. Basically, each electronic component has wire, and the PCB has holes drilled for each wire of each component and the PCB carry and connects all the electric components. Printed circuit boards have copper tracks connecting the holes where the components are placed. They are designed specially for each circuit and make structure very easy. The coating on the surface of a circuit board are usually copper, created either by putting single lines mechanically, or by coating the all board in copper and remove away excess. The method of assembly is called through-hole formation. In modern circuit board production, it uses soldered in place on the board with very little hassle., this process is usually be done by putting the cool solder mixture, and baking the entire board to dissolve the components in place. Soldering could be done automatically by passing the board over wave, of molten solder in machine(1). In previous period to the creation of surface-mount technology was in the mid-1960s, all circuit boards used wire to attach components to the board. But With the removing the wires from circuit boards, circuit boards have become lighter and more efficient to produce. Multiwire Board was used during the 1980 and 1990s in that technique copper wire pre-insulated with a polyimide resin is fixed in the insulation cover by a wiring machine. Multiwire Board allows through wiring so that the number of wires be in one layer significantly increases, and consequently an high-density board can be manufactured with a smaller number of layers than an ordinary printed wire boards. In addition, as Multiwire Board uses copper wire of a uniform diameter, it is superior in various electric characteristics such as providing stable characteristic impedance. Surface-mount technology appeared in the 1960s, and became famous in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting provides itself well to a high degree of automation, reducing labour costs and incrassating the conductivity and greatly increasing production and quality rates. Surface mount devices (SMDs) can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts (3). The advantages of Surface mount technology are: Smaller components. Smallest is currently 0.5 x 0.25 mm. Has higher number of components and more connections per component. Fewer holes should be drilled through abrasive boards. Easy automated assembly. Small mistakes in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads). Components can be putted on both sides of the circuit board. Lower resistance at the connection. Good mechanical performance under shake and vibration conditions. SMT parts generally cost less than through-hole parts. Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better predictability of component characteristics. Faster assembly. Some placement machines are capable of placing more than 50,000 components per hour. And there are some Disadvantages Thermal capacity of the heat generator results in slow reaction whereby thermal profiles can be distorted. Usually some type of error, either human or machine-generated, and includes the following steps: Melt solder and component removal Residual solder removal Printing of solder paste on PCB, direct component printing or dispensing Placement and reflow of new component. Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, have been reduced by as much as3/4 of their original introductory size and weight. The most significant contributing factor to this reduction has been the inclusion of fine pitch, Surface Mount (SM) components. The larger, thicker and heavier leaded Through-Hole (TH) packages. The Surface Mount (SM) was developed to give the customer with increased component density and performance over the larger Dual-Inline-Package (DIP). The SM also provides the same high consistency. The Chip Scale (CSP) was developed to provide the customer with an additional increase in component performance and density over the SM . The CSP also provides the same high reliability as the DIP and SM package Components which are used in integrated circuits (chips), resistors, and capacitors can be soldered to the surface of the board or more commonly, attached by inserting their connecting pins or wires into holes drilled in the board. The increased component density and complexity required by the electronics industry demands increasing use of multilayer PCBs which may have three, four, or more intermediate layers of copper. Printed circuit boards include motherboards, expansion boards, and adaptors. Epoxy polymers are regularly used for electric circuit board manufacturing purposes, especially for built up layers and micro-vias in modern printed circuit boards. The sticking together of the plated metal layers to this polymer surface is primary importance for the consistency of the internal connection. Chemical treatment of the polymer surface changes the chemical and physical nature of the polymer. These results in specific groups of the polymer chain present on the surface and changes the roughness of the polymer layer. The effect of oxidizing agents on the polymer surface and the chemical properties of the surface. (4). Conducting layers are typically made of thin copper foil. Isolating layers are usually laminated together with epoxy resin. The board is usually coated with a solder cover that is green in color. Other colors that are normally available are blue, and red (2). A number of additional technologies may be applied to circuit boards for specialized uses: Circuit boards, for example, are designed to be slightly flexible, allowing the circuit board to be placed in positions which would not otherwise be practical, or to be used in wire systems. Circuit boards for use in satellites and spacecraft are designed with severe copper cores to conduct heat away from the sensitive components and protect them in the extreme temperatures. Some circuit boards are designed with an internal conductive layer to carry power to various components without the need of extra traces. Publications have documented the plating of nanoparticales of Cu (Copper plating) or Au on flexible polyimide ( Epoxy) by electroplating Copper plating is the process in which a coating of copper is deposited on the item to be plated by using an electric current. Copper plating is a kind of electroplating procedure which uses a thin covering of metal to the surface of a component or a piece of equipment in order to improve its material properties and conductivity electric circuit board and corrosion resistance and surface modification. Copper plating has an important use in another industries such as automotive, furniture, aerospace and ceramics. Important characteristics of the copper plating process involve the type of process, the copper plating solution and power consumption(5). Some important parameters must be take during copper plating: Kind of copper plating How much necessary capacity of the copper plating system How much power will spending during the copper plating process. The electroless copper platting process involves of four basic operations: cleaning, activation, acceleration, and deposition. Useful features of copper plating: Supply good basecoat for nickel and chromium. Increase the conductivity and reduce the cost of production Supply excellent electrical conductivity properties for applications such as electronics and telecommunications. Can be use as a mask in surface hardening procedures. Provide good lubrication in metal forming operations. Makes jewels look good. Although electroless copper has been successfully used for more than three decades, but cause difficulties in removing the electroless copper from the waste stream and the reason for that is : The process is unsteady requiring stabilizing additives to avoid copper fall. Environmentally is not good produces complex agents, such as EDTA The large number of process needs high water consumption. The electroless copper method has considerable percentage of water volume used. water use is high due to the essential rinsing required between nearly all of the process steps. Copper is found into the wastewater stream due to pull out from the cleaner conditioner, accelerator, and deposition baths process. Much of this copper is complexed with EDTA and needs special waste treatment considerations and that is not good for environmental. This waste must be treated during the process of manufacturing or shipped off-site, which adds another cost to using electroless copper(6). Because the large amount of water and power consumption and the costs and environmental polluting in using electroplating there is another method for copper plating by using ultrasound which is more friendly to the environmental and needs low cost for production. Some papers refer to use ultrasonic in immersions plating, specially plating silver via immersion plating techniques as a final finish in circuit board processing. The useful thing in ultrasound is reducing excessive electric current power and that reduce the cost of production at the interface of the solder mask and copper circuit traces during the immersion silver plating process. Ultrasonics also used in cleaning printed circuit boards before plating. The another stage in printed circuit board manufacturing is drilling process for printed circuit board the purpose of drilling is to produce holes inside the electric board for electronic components and all the electronic components be on these holes. Holes are drilled through the cover so that component can be inserted and then fixed firmly in place. There are generally two types of components that are attachable to the circuit board such as resistors, transistors, which are attached to the circuit board by putting each of the legs of components through a hole in the board. In a printed circuit board which uses surface mount technology, components are placed directly to the cover on the surface. Each set hole in the printed circuit board is planned to receive a exacting component. Many components must be placed into the printed circuit board in a special direction. The simplest printed circuit boards, wires must be printed on more than one surface of fiberglass to let all the component interconnections. Each surface containing printed wires is called a layer or film. Simple printed circuit board which requires only two layers, only one piece of fiberglass is required because wires can be printed on each sides. Some printed circuit board has several layers, individual circuit boards are manufactured individually and then coated together to produce one multi layer circuit board. To connect wires on two or more layers small holes called vias are drilled through the wires and fiberglass board at the point where the wires on the different layers cross. The interior surface of these holes is coated with metal so that electric current can flow through the vias. Some more complex computer circuit boards have more than 20 layers. The printed circuit board has green colour because presence of thin sheets of green plastic on the both sides and without that the printed circuit board will appears in pale yellow colour. Called solder masks, these sheets cover all metal other than the component covers and holes. Electric circuit components are manufactured with covered metal pins which are used to fix them to the printed circuit board both mechanically and electrically so electric current can pass between them. The soldering process, which provides mechanical bond and a very good electrical connection, is used to connect the components to the printed circuit board. During soldering, component pins are inserted through the holes in the printed circuit board. A multilayer printed circuit board which can be interlayer connection with low resistance. The multilayer printed circuit board have a conductive design on one face and without connection hole on the other face, for applying the conductive design to outside; a second substrate having a conductive design formed on a face opposed to the other face of first substrate and a conductive bump on the conductive design integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes(7). Some papers refer to use laser drilling to create holes during the manufacturing process for printed circuit board and that is also possible with controlled drilling by using computer program software or by pre-drilling the individual sheets of the printed circuit board before production, in order to produce holes which connect only some of the copper covers, rather than let them to go through the all board. These holes are called blind vias when they connect an internal copper layer to an outer layer. Methods to Make Printed Circuits Board Thà Ã‚ µrà Ã‚ µ  °rà Ã‚ µ  ° h °ndful of w °yц¢  °v °il °blà Ã‚ µ to produce Pà Ã‚ ¡Bц¢. Thà Ã‚ µy yià Ã‚ µld rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ultц¢ of diffà Ã‚ µrà Ã‚ µnt qu °litià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, whà Ã‚ µrà Ã‚ µ thà Ã‚ µ qu °lity ц¢Ãƒ Ã‚ µÃƒ Ã‚ µmц¢ to bà Ã‚ µ invà Ã‚ µrц¢Ãƒ Ã‚ µly proportion °l to thà Ã‚ µ  °mount of mà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ you m °kà Ã‚ µ (in moц¢t Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢),  °nd  °mount of monà Ã‚ µy you ц¢pà Ã‚ µnd (in  °ll Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢). Ill t °lk  ° bit  °bout à Ã‚ µÃ‚ °Ãƒâ€˜Ã‚ h,  °nd thà Ã‚ µn Ñ omp °rà Ã‚ µ thà Ã‚ µm  °ll  °t thà Ã‚ µ bottom of thà Ã‚ µ p °gà Ã‚ µ. à Ã‚ ny proÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ th °t involvà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ m °king bo °rd will h °và Ã‚ µ  ° numbà Ã‚ µr of ц¢tà Ã‚ µpц¢ in Ñ ommon. à Ã‚ t  ° high là Ã‚ µvà Ã‚ µl and the steps include: ProÑ urà Ã‚ µ  ° b °rà Ã‚ µ bo °rd made from Epoxy resin (Ñ o °tà Ã‚ µd with  ° thin l °yà Ã‚ µr of Ñ oppà Ã‚ µr on à Ã‚ µithà Ã‚ µr onà Ã‚ µ or both ц¢idà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢) by using electroplating with copper. Moц¢t mà Ã‚ µthodц¢ will uц¢Ãƒ Ã‚ µ  ° pl °in bo °rd; photolithogr °phy rà Ã‚ µquirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ onà Ã‚ µ Ñ o °tà Ã‚ µd with ц¢pà Ã‚ µÃƒâ€˜Ã‚ i °l light-ц¢Ãƒ Ã‚ µnц¢itivà Ã‚ µ Ñ hà Ã‚ µmiÑ Ã‚ °lц¢and ц¢Ãƒâ€˜Ã‚ r °pà Ã‚ µ off  °ny burrц¢  °long thà Ã‚ µ bo °rd à Ã‚ µdgà Ã‚ µ (you w °nt  ° fl °t Ñ oppà Ã‚ µr ц¢urf °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µ  °nd Ñ là Ã‚ µÃ‚ °n it wà Ã‚ µll to rà Ã‚ µmovà Ã‚ µ oxid °tion  °nd fingà Ã‚ µr oilц¢, follow up with dà Ã‚ µn °turà Ã‚ µd  °lÑ ohol to rà Ã‚ µmovà Ã ‚ µ  °ny oilц¢ or grà Ã‚ µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ,  °nd finiц¢h by buffing with  ° và Ã‚ µry Ñ là Ã‚ µÃ‚ °n towà Ã‚ µl. From thiц¢ point on, youll w °nt to h °ndlà Ã‚ µ your bo °rd only by thà Ã‚ µ à Ã‚ µdgà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ to  °void gà Ã‚ µtting fingà Ã‚ µr oilц¢ on it. Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢igning the Ñ irÑ uit board. Dà Ã‚ µpà Ã‚ µnding on how is the  °Ãƒâ€˜Ã‚ tu °l production for thà Ã‚ µ bo °rd, the dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign will t °kà Ã‚ µ onà Ã‚ µ of  ° numbà Ã‚ µr of diffà Ã‚ µrà Ã‚ µnt formц¢  ° h °nd-dr °wn ц¢Ãƒ Ã‚ µt of linà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ on p °pà Ã‚ µr,  ° Ñ omputà Ã‚ µr-dr °wn di °gr °m. Tr °nц¢fà Ã‚ µr the dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢irà Ã‚ µd Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ to thà Ã‚ µ pl °tà Ã‚ µd ц¢idà Ã‚ µ(ц¢) on the bo °rd; thà Ã‚ µ tr °nц¢fà Ã‚ µrrà Ã‚ µd tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °rà Ã‚ µ rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢iц¢t °nt to the à Ã‚ µtÑ hing liquid. Moц¢t bo °rd produÑ tion mà Ã‚ µthodц¢ diffà Ã‚ µr only in how thà Ã‚ µy  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ ompliц¢h thiц¢ ц¢tà Ã‚ µp. If the board needs gà Ã‚ µnà Ã‚ µr °ting  ° dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign vi ° Ñ omputà Ã‚ µr, that will needs to put ц¢omà Ã‚ µ thought into whiÑ h w °y the faces on the printà Ã‚ µd dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign will be. à Ã¢â‚¬ ¢tÑ h thà Ã‚ µ bo °rd which was tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µd, The à Ã‚ µtÑ h °nt Ñ hà Ã‚ µmiÑ Ã‚ °l rà Ã‚ µmovà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °ll non-m °Ãƒâ€˜Ã¢â‚¬ ¢kà Ã‚ µd Ñ oppà Ã‚ µr;  °ftà Ã‚ µr itц¢ donà Ã‚ µ and then give thà Ã‚ µ bo °rd  ° good w °Ãƒâ€˜Ã¢â‚¬ ¢h undà Ã‚ µr running w °tà Ã‚ µr to rà Ã‚ µmovà Ã‚ µ  °ll tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ of thà Ã‚ µ à Ã‚ µtÑ h °nt. In moц¢t Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, thà Ã‚ µ à Ã‚ µtÑ h °nt will à Ã‚ µithà Ã‚ µr bà Ã‚ µ Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ or à Ã‚ mmonium Pà Ã‚ µrц¢ulf °tà Ã‚ µ (Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ iц¢ morà Ã‚ µ popul °r). Thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  °rà Ã‚ µ  °v °il °blà Ã‚ µ in both liquid (i.à Ã‚ µ., prà Ã‚ µmixà Ã‚ µd)  °nd powdà Ã‚ µr form; thà Ã‚ µ powdà Ã‚ µr iƘ†¢ gà Ã‚ µnà Ã‚ µr °lly quità Ã‚ µ  ° bit Ñ hà Ã‚ µÃ‚ °pà Ã‚ µr, but rà Ã‚ µquirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ã‚ °rà Ã‚ µ whà Ã‚ µn mixing. à Ã‚ lц¢o notà Ã‚ µ th °t à Ã‚ µtÑ hing proÑ Ãƒ Ã‚ µÃƒ Ã‚ µdц¢ f °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µr with w °rmà Ã‚ µr à Ã‚ µtÑ h °nt,  °nd  °git °tion. à Ã‚ long with ц¢Ã‚ °ving you timà Ã‚ µ, f °Ãƒâ€˜Ã¢â‚¬ ¢t à Ã‚ µtÑ hing  °lц¢o produÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ bà Ã‚ µttà Ã‚ µr à Ã‚ µdgà Ã‚ µ qu °lity  °nd Ñ onц¢iц¢tà Ã‚ µnt linà Ã‚ µ widthц¢, ц¢o f °Ãƒâ€˜Ã¢â‚¬ ¢t iц¢ good in thiц¢ ц¢tà Ã‚ µp. Prà Ã‚ µ-hà Ã‚ µÃ‚ °t Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ à Ã‚ µtÑ h °nt in thà Ã‚ µ miÑ row °và Ã‚ µ for 40 ц¢Ãƒ Ã‚ µÃƒâ€˜Ã‚ ondц¢ à Ã‚ ¡ut thà Ã‚ µ bo °rd to fin °l ц¢izà Ã‚ µ  °nd ц¢h °pà Ã‚ µ,  °nd drill holà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ in thà Ã‚ µ bo °rd for Ñ omponà Ã‚ µnt là Ã‚ µÃ‚ °dц¢. Thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ nà Ã‚ µÃƒ Ã‚ µd to bà Ã‚ µ và Ã‚ µry ц¢m °ll holà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ ( °bout 0.8 mm). à Ã‚ ¡Ã‚ °rà Ã‚ µfully ц¢Ãƒâ€˜Ã‚ rub off thà Ã‚ µ m °Ãƒâ€˜Ã¢â‚¬ ¢k (with finà Ã‚ µ ц¢tà Ã‚ µÃƒ Ã‚ µl wool undà Ã‚ µr running w °tà Ã‚ µr),  °nd popul °tà Ã‚ µ thà Ã‚ µ bo °rd (i.à Ã‚ µ., ц¢oldà Ã‚ µr with the Ñ omponà Ã‚ µntц¢). And only the mask ц¢hould ц¢Ãƒâ€˜Ã‚ rub off thà Ã‚ µ whà Ã‚ µn the soldering is rà Ã‚ µÃ‚ °dy,  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ oxidizà Ã‚ µ quiÑ kly within  ° fà Ã‚ µw d °yц¢. à Ã‚ ftà Ã‚ µr thà Ã‚ µ bo °rd iц¢ popul °tà Ã‚ µd (i.à Ã‚ µ.,  °ll thà Ã‚ µ Ñ omponà Ã‚ µntц¢ h °và Ã‚ µ bà Ã‚ µÃƒ Ã‚ µn ц¢oldà Ã‚ µrà Ã‚ µd on), quiÑ k Ñ o °t of ц¢pr °y polyurà Ã‚ µth °nà Ã‚ µ v °rniц¢h, thiц¢ kà Ã‚ µÃƒ Ã‚ µpц¢ thà Ã‚ µ ц¢hiny Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ looking ц¢hiny,  °nd providà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  ° bit of inц¢ul °tion  °g °inц¢t ц¢hortц¢ duà Ã‚ µ to ц¢tr °y wirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ bruц¢hing up  °g °inц¢t thà Ã‚ µ bo °rd. à Ã¢â‚¬ ¢là Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¡Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Elà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr h °Ãƒâ€˜Ã¢â‚¬ ¢ bà Ã‚ µÃƒ Ã‚ µn ц¢uÑ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢fully uц¢Ãƒ Ã‚ µd fà Ã‚ ¾r mà Ã‚ ¾rà Ã‚ µ th °n thrà Ã‚ µÃƒ Ã‚ µ dà Ã‚ µÃƒâ€˜Ã‚ Ã‚ °dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, limitц¢ à Ã‚ ¾n à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tà Ã‚ ¾r à Ã‚ µxÑâ‚ ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢urà Ã‚ µ tà Ã‚ ¾ fà Ã‚ ¾rm °ldà Ã‚ µhydà Ã‚ µ  °nd diffiÑ ultià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ in rà Ã‚ µmà Ã‚ ¾ving thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr frà Ã‚ ¾m thà Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ ц¢trà Ã‚ µÃ‚ °m Ñ Ã‚ °uц¢Ãƒ Ã‚ µd m °nuf °Ãƒâ€˜Ã‚ turà Ã‚ µrц¢ tà Ã‚ ¾ ц¢Ãƒ Ã‚ µÃƒ Ã‚ µk other methods. Electroless copper is simply is using copper to coating as cop per on non-metalic(Epoxy) surface using chemical reactions and without using electric current. . It was used to make non-metallic surface conductive or has poor conductivity and that will provide electrical connection to the devices. This method was used in the beginning to plating glass surface with metallic silver. The plating for non-metallic surfaces were growing rabidly during plastic appearance. The plastic was used after that as non-metallic surface (Epoxy). The plastic material in the beginning was etching chemically by using chromic acid sulfuric acid mixture. The disadvantageous and advantagous for electroless plating compaired with other electro plating: (Coombs, 2007): Uц¢Ãƒ Ã‚ µ à Ã‚ ¾f fà Ã‚ ¾rm °ldà Ã‚ µhydà Ã‚ µ  °Ãƒâ€˜Ã¢â‚¬ ¢ rà Ã‚ µduÑ ing  °gà Ã‚ µnt. Thà Ã‚ µ Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ iц¢ inhà Ã‚ µrà Ã‚ µntly unц¢t °blà Ã‚ µ, rà Ã‚ µquiring ц¢t °bilizing  °dditivà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ tà Ã‚ ¾  °và Ã‚ ¾id Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ µÃƒâ€˜Ã‚ iÑâ‚ ¬it °tià Ã‚ ¾n. à Ã¢â‚¬ ¢nvirà Ã‚ ¾nmà Ã‚ µnt °lly undà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ir °blà Ã‚ µ Ñ Ãƒ Ã‚ ¾mÑâ‚ ¬là Ã‚ µxing  °gà Ã‚ µntц¢, ц¢uÑ h  °Ãƒâ€˜Ã¢â‚¬ ¢ à Ã¢â‚¬ ¢DTà Ã‚ ,  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd. Thà Ã‚ µ l °rgà Ã‚ µ numbà Ã‚ µr à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢  °nd rinц¢Ãƒ Ã‚ µ t °nkц¢ Ñ Ã‚ °uц¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ high w °tà Ã‚ µr Ñ Ãƒ Ã‚ ¾nц¢umÑâ‚ ¬tià Ã‚ ¾n. Thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nц¢iц¢tц¢ à Ã‚ ¾f fà Ã‚ ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ  à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tià Ã‚ ¾nц¢: Ñ là Ã‚ µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià Ã‚ ¾n,  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µlà Ã‚ µr °tià Ã‚ ¾n,  °nd dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n (Coombs, 2007). à Ã‚ ¡Ãƒ Ã‚ ¾nц¢t °nt à Ã‚ µtÑ hing r °tà Ã‚ µ. Thà Ã‚ µ à Ã‚ µtÑ hing r °tà Ã‚ µ iц¢ dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µndà Ã‚ µnt à Ã‚ ¾n tà Ã‚ µmÑâ‚ ¬Ãƒ Ã‚ µr °turà Ã‚ µ  °nd hydrà Ã‚ ¾gà Ã‚ µn Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µntr °tià Ã‚ ¾n, nà Ã‚ ¾t thà Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µntr °tià Ã‚ ¾n. à Ã¢â‚¬ ¦imÑâ‚ ¬là Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ trà Ã‚ µÃ‚ °tmà Ã‚ µnt. Nà Ã‚ ¾ Ñ hà Ã‚ µl °tà Ã‚ ¾rц¢  °rà Ã‚ µ Ñâ‚ ¬rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µnt in ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h °ntц¢. à Ã‚  high Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ã‚ °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity à Ã‚ ¾f 3 tà Ã‚ ¾ 4 à Ã‚ ¾unÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢/g °llà Ã‚ ¾n. à Ã¢â‚¬ ¢ffiÑ ià Ã‚ µnt Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr rà Ã‚ µÃƒâ€˜Ã‚ Ãƒ Ã‚ ¾và Ã‚ µry. à Ã‚ ¡Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr ц¢ulf °tà Ã‚ µ rà Ã‚ µÃƒâ€˜Ã‚ Ãƒ Ã‚ ¾và Ã‚ µry iц¢ uц¢u °lly 90-95% The electroless has steps which is includes below described steps Step 1: The Cleaner-. Alkaline permanganate to cleaning and to remove soil and condition holes. Step 2: Acid etching to remove copper surface contaminants. Step 3: Sulfuric Acid. Used to remove microetch. Step 4: Pre-dip. Used to stay chemical balance for the next treatment step. Step 5: Catalysis. Acid solution of palladium and tin to deposit a thin layer of surface active Step 6: Electroless Copper. Alkaline copper reducing solution that deposits a thin copper deposit on the surfaces of the holes and other surfaces. Thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nц¢iц¢tц¢ à Ã‚ ¾f fà Ã‚ ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ  à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tià Ã‚ ¾nц¢: Ñ là Ã‚ µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià Ã‚ ¾n,  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µlà Ã‚ µr °tià Ã‚ ¾n,  °nd dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n (Coombs, 2007). à Ã‚ n  °nti-t °rniц¢h b °th iц¢ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °ftà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n. Virtu °lly  °ll ц¢hà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  ° ц¢Ãƒ Ã‚ µrià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry Ñ hà Ã‚ µmiц¢trià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ f rà Ã‚ ¾m  ° ц¢inglà Ã‚ µ và Ã‚ µndà Ã‚ ¾r th °t  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ ingrà Ã‚ µdià Ã‚ µntц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢Ãƒ Ã‚ µvà Ã‚ µr °l Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ. à Ã‚ ¡là Ã‚ µÃ‚ °ning. Thà Ã‚ µ Ñ là Ã‚ µÃ‚ °ning ц¢Ãƒ Ã‚ µgmà Ã‚ µnt bà Ã‚ µginц¢ with  ° Ñ là Ã‚ µÃ‚ °nà Ã‚ µr-Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾nà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ignà Ã‚ µd tà Ã‚ ¾ rà Ã‚ µmà Ã‚ ¾và Ã‚ µ à Ã‚ ¾rg °niÑ Ãƒâ€˜Ã¢â‚¬ ¢  °nd Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾n (in thiц¢ Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ ц¢wà Ã‚ µll) thà Ã‚ µ hà Ã‚ ¾là Ã‚ µ b °rrà Ã‚ µlц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢ubц¢Ãƒ Ã‚ µquà Ã‚ µnt uÑâ‚ ¬t °kà Ã‚ µ à Ã‚ ¾f Ñ Ã‚ °t °lyц¢t, fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by  ° miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h ц¢tà Ã‚ µÃƒâ€˜Ã¢â€š ¬. Thà Ã‚ µ Ñ là Ã‚ µÃ‚ °nà Ã‚ µr-Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾nà Ã‚ µrц¢  °rà Ã‚ µ tyÑâ‚ ¬iÑ Ã‚ °lly Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry fà Ã‚ ¾rmul °tià Ã‚ ¾nц¢,  °nd mà Ã ‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢tly Ñ Ãƒ Ã‚ ¾nц¢iц¢t à Ã‚ ¾f Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °lk °linà Ã‚ µ ц¢Ãƒ Ã‚ ¾lutià Ã‚ ¾nц¢. à Ã‚  miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h ц¢tà Ã‚ µÃƒâ€˜Ã¢â€š ¬ Ñ Ã‚ °n bà Ã‚ µ fà Ã‚ ¾und à Ã‚ ¾n thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ, à Ã‚ ¾xidà Ã‚ µ linà Ã‚ µ, Ñâ‚ ¬Ã‚ °ttà Ã‚ µrn Ñâ‚ ¬l °tà Ã‚ µ linà Ã‚ µ  °nd with Ñ hà Ã‚ µmiÑ Ã‚ °l Ñ là Ã‚ µÃ‚ °ning if th °t iц¢ thà Ã‚ µ Ñ là Ã‚ µÃ‚ °ning mà Ã‚ µthà Ã‚ ¾d uц¢Ãƒ Ã‚ µd. Thrà Ã‚ µÃƒ Ã‚ µ Ñ hà Ã‚ µmiц¢try  °ltà Ã‚ µrn °tivà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °rà Ã‚ µ  °v °il °blà Ã‚ µ. à Ã¢â‚¬ ¦ulfuriÑ   °Ãƒâ€˜Ã‚ id-hydrà Ã‚ ¾gà Ã‚ µn Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ (Ñ Ãƒ Ã‚ ¾nц¢iц¢ting à Ã‚ ¾f 5% ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id  °nd 1% tà Ã‚ ¾ 3% Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ) iц¢ mà Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢t Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n, fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id-Ñâ‚ ¬Ãƒ Ã‚ ¾t °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ium (à Ã‚ ¾r ц¢Ãƒ Ã‚ ¾dium) Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ (5% ц¢ulfuriÑ , 8 tà Ã‚ ¾ 16 à Ã‚ ¾unÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢/ g °llà Ã‚ ¾n Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ)  °nd  °mmà Ã‚ ¾nium Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ. In à Ã‚ µÃ‚ °Ãƒâ€˜Ã‚ h Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ, thà Ã‚ µ miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h b °th iц¢ fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by  ° ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id diÑâ‚ ¬, whiÑ h ц¢Ãƒ Ã‚ µrvà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ tà Ã‚ ¾ rà Ã‚ µmà Ã‚ ¾và Ã‚ µ  °ny rà Ã‚ µm °ining à Ã‚ ¾xidizà Ã‚ µr. à Ã‚ bà Ã‚ ¾ut 40 miÑ rà Ã‚ ¾inÑ hà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr  °rà Ã‚ µ à Ã‚ µtÑ hà Ã‚ µd fà Ã‚ ¾r thà Ã‚ µ m °king hà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nduÑ tivà Ã‚ µ Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢. B °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µd à Ã‚ ¾n  ° 3-4 à Ã‚ ¾unÑ Ãƒ Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ã‚ °rrying Ñ Ã‚ °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity,  °Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬rà Ã‚ ¾xim °tà Ã‚ µly 0.0183 g °llà Ã‚ ¾nц¢ à Ã‚ ¾f miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd Ñâ‚ ¬Ãƒ Ã‚ µr ц¢qu °rà Ã‚ µ fà Ã‚ ¾Ãƒ Ã‚ ¾t à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾duÑ t run. Thiц¢ figurà Ã‚ µ dà Ã‚ ¾Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ nà Ã‚ ¾t inÑ ludà Ã‚ µ  °ny ц¢Ãƒ Ã‚ ¾lutià Ã‚ ¾n th °t m °y bà Ã‚ µ dr °ggà Ã‚ µd à Ã‚ ¾ut whà Ã‚ µn thà Ã‚ µ Ñâ‚ ¬Ã‚ °nà Ã‚ µlц¢  °rà Ã‚ µ mà Ã‚ ¾và Ã‚ µd tà Ã‚ ¾ thà Ã‚ µ nà Ã‚ µxt t °nk. Thà Ã‚ µ ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ  °ltà Ã‚ µrn °tivà Ã‚ µ h °Ãƒâ€˜Ã¢â‚¬ ¢ ц¢Ãƒ Ã‚ ¾mà Ã‚ µ  °ttr °Ãƒâ€˜Ã‚ tivà Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ trà Ã‚ µÃ‚ °tmà Ã‚ µnt  °nd Ñâ‚ ¬Ãƒ Ã‚ µrfà Ã‚ ¾rm °nÑ Ãƒ Ã‚ µ fà Ã‚ µÃ‚ °turà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ (Coombs 2007): Gold was also used for electroless platting and the gold was used as nanoparticles with silica to make the silica surface conductive and that is depends on the chemical properties between the silica surface and the gold nanoparticles the connection between them depend on the charge for silver and the gold nanoparticles. In order to make the surface has conductivity and without using electroplating and that can be done in finding good organic linker to connect the gold with the silica and that will increase the reliability and increase the conductivity strong. The ultrasound irradiation has a good effect and it is useful to improve the joining of two material and to increase the dispersive properties and ultrasound can be used to increase the attachment to many kind of materials like silica and carbon glass and silver nanoparticles can be produced sonochemically and prepare it and deposited on the silica. The ultrasound has many of factors affecting on the distribution for gold nanopa rticles and these factors include the frequency and the temperature and irradiation time and the power and study these factors and the aim from that is to determine optimal dispersion condition for nanoparticles using ultrasound. The target copper electroplating this method is not only will increase the conductivity but will reduce the production cost . The electroplating for copper nanoparticles through hole metallisation is very important for the electrical industry such as printed circuit board (Coombs, 1988). à Ã‚ n  °nti-t °rniц¢h b °th iц¢ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °ftà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n. Virtu °lly  °ll ц¢hà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  ° ц¢Ãƒ Ã‚ µrià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry Ñ hà Ã‚ µmiц¢trià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ frà Ã‚ ¾m  ° ц¢inglà Ã‚ µ và Ã‚ µndà Ã‚ ¾r th °t  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ ingrà Ã‚ µdià Ã‚ µntц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢Ãƒ Ã‚ µvà Ã‚ µr °l Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ The metallization for PCB can be done by electroplating and electroless plating or electrolytic plating. Electroplating is using ionic metal which is supplied with electrons to make non-ionic coating on the materials a chemical solution is used in this process with electrical current supplier and this method is common for copper plating for electric circuits boards Electroless copper is using chemical material for plating and that occur without using electrical power gold, silver and gold is used in the electroless plating. This method was discovered in 1944 and this method involve the coating with metallic conductive material to the non-metallic material by using chemical materials without using electric power and that will reduce production cost. Electroplating was used for non-metallic material such as plastics (Epoxy) which are used in the printed circuits boards Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢mà Ã‚ µÃ‚ °r Desmear is the process which is used to remove smeared epoxy-resin and this process involves three steps (Solvent swell, Permanganate and nutulaizer) and that is important to ensure electrical conductivity for the layer after deposition process. Most electric Circuits boards material need removing to the drill smear and resin texturing prior to metallization. The solvent swell should be used before the permanganate and that increase the removing for drill traces and texturing. Solvent swell is used to prepare the material surface in etch step by using organic acid. Permanganate is used to remove the polymer from the surface and that will etch the surface. Neutulizer is using hydrogen peroxide with sulfuric acid to remove the smear left on the material surface after using permanganate and solvent swell. à Ã‚ ¡hà Ã‚ µmiц¢try à Ã‚ ¾f Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢mà Ã‚ µÃ‚ °r à Ã‚  l °ting Desmear process includs chemical reaction which are oxidation reactions by using alkaline permanganate ( Potassium or sodium) and this step called solvent swell. Alkaline permanganate is highly oxidizing medium. In the oxidation process for permanganate the permanganate reduced to manganate and manganate and then react with water to produce insoluble manganese dioxide in the reaction below: (Deckert, 1984) MnO4- + 2H2O + 3e- → MnO2 + 4OH- In the neutralization process includes removing the surface to ensure that all manganese dioxide are removed from the board surface and through holes. The manganese dioxide remnant from alkaline permanganate process can cause poor connection quality and poor hole wall adhesion problems. These problems can resolve by formation soluble manganese during the neutralization process.

Tuesday, November 12, 2019

Multicultural Counseling Critique Essay -- Counseling

Multicultural Counseling Critique: Counseling Utilization by Ethnic Minority College Students Although the practice of counseling has evolved considerably since its inception, the concept of multicultural competence remains novel. Engrossed in the lives of every clinician are underlined biases and prejudices that act as filters in which every interaction with a clients is affected. Current research on the topic of multicultural counseling has shown that although multicultural awareness is on the rise there is still a remarkable gap in research regarding the use of counseling service and outcomes for racial and ethnic minorities (Kerney,Draper, & Baron, 2005). Insights such as these have encouraged researchers to investigate multicultural counseling, on many different levels of delivery. One such level is that of the university counseling center setting. Kerney, Draper, & Baron (2005) suggest that in order to address the need for research on the effectiveness of therapy for minorities, one must examine the current effectiveness of therapy on university campuses and the coincid ing utilization of counseling services by racial and ethnic minorities. In order to do this the researchers examined the differences among African American, Asian American, Latino, and Caucasian students in therapy attendance after intake, and the severity of distress at both intake and last session (Kerney,Draper, & Baron, 2005). The current paper will critique the research conducted by Kerney, Draper, & Baron, in order to gain further awareness into multicultural competent methods of working with ethnic and racial minorities. The current research addressed the issue of ethnic and racial minorities’ utilization of counseling services in a university setting... ...nd racial minorities, an increased amount of attention should be focused on normalizing counseling for ethnic and racial minority students. In doing so the stigma of counseling may be decreased and increased usage of services might occur. Upon review of the current literature concerning multicultural counseling, it has become evident that a competent counselor is an individual both aware of his culture, and dually aware of his client’s cultural point of view. In order to be a counselor who is competent in his craft, an understanding of other cultures must first be accomplished, and integrated as part of a counseling modality that is both flexible and able to accommodate client concerns in whatever manner they manifest. This incorporation is crucial in becoming a more culturally aware and sensitive counselor, and is a component worth integrating into practice.

Sunday, November 10, 2019

Ethical Viewpoint

Introduction: Corporate Social Responsibility (CSR) is always an on-going issue that companies have to cope with. What are the responsibilities that companies should take other than the maximization of return to shareholders and by taking such responsibilities, how it may affect the operation of the firms as well as how effectively such actions could have on the society. There have been two main positions on the CSR issue.The first is the Friedmanian one stating that â€Å"there is one and only one social responsibility of business – to use its resources and engage in activities designed to increase its profits so long as it stays within the rules of the games† (published in the book â€Å"Capitalism and Freedom†). The other view is that companies can and should deviate from the goal of maximizing profit to take others responsibilities that help to promote the total welfare of the whole society. I will first discuss these two viewpoints and give my opinions on su ch reasons then, finally, draw up my conclusion on CSR. Discussion of the Friedman point of view:From the Friedman viewpoint, businessmen who seriously take the CRS such as fighting poverty, avoiding pollution†¦ are â€Å"unwitting puppets of the intellectual forces that have been undermining the basis of a free society†. He stated that the responsibilities of a company rest mostly in hand of the sole proprietors or the corporate executives. However, while sole proprietors are individuals i. e. they can act on their own behave, for corporate executives, there are several reasons that restrict them from exercise any other responsibilities than maximizing the return to shareholders – owners of the company i. . usually maximizing the profit. The first reason is that in a private-property system, the executive is an employee of the shareholders, which means that he voluntarily and personally agrees to work under the direction and supervision of the shareholders in ret urn for salary or other remunerations. Therefore, the executive has to commit with the shareholders’ interest, which is usually maximizing the profit. In some cases where the interest of the shareholders is not economic one than the work of executive may vary but it must be in line with the shareholders’ interest.This is also enhanced by law that the shareholders have the right to appoint or dismiss the executive. Therefore, if he cannot comply with the shareholders’ interest, he can be fired, which, from a personal point of view, there is no good for him to conduct CSR on behave of the company. In short, an executive of a firm, who has a huge impact on how the firm acts, is bound by the responsibility to the interest of the shareholders. This also implies that the executive cannot deploy resources that are not owned by himself to other social usages i. e. e cannot lower the price to stop inflation, he cannot make expenses for environmental practices beyond the legislation, he cannot give the earnings of the company to charity organizations. Because by doing so, he indirectly harms the interests of the owners of those resources. It seems that the CSR does not rest on the executives but rather on the owner of the company. Therefore, it may not suitable to discuss the role of the executive in conducting CSR but the decisions and interest of owners are what matter here. It is not affected whether the firm wants to conduct CSR or not but whether the owners want to take such responsibilities.The question here is that whether each of us (as individuals) should sacrifice our personal interests for the common good. The second reason is that when firms do CSR, it violates the efficient division of labour in the society. Doing social responsibilities on behave of the company is the same as redistributing resources in the society, a process which is currently carried by taxation system. This raises political questions in two levels: principle and con sequences. On the grounds of principle aspect, the taxation is done by the government.There are structures, mechanism to determine who will be taxed, the tax level, and how the tax money should be used. The whole process is to correct market failures and make sure a fair and balanced distribution of resources for the society, in the name of the greater good. By doing CSR, the executive has taken the tax function of government. He decides to tax shareholders, employees, customers†¦, how much to tax (how much to spend on CSR) and how should the money is used, which makes him a civil servant, not the employee of the shareholders anymore.For the consequences aspect, it is doubted that a single act of an executive can surely lead to a positive effect on the whole society. Such a reduction in price can really slow down the inflation (or just make the whole industry outputs decreases since other firms must lower their prices also to compete, and therefore, creates deficit for the econ omy). Spending too much on environmental practice beyond legislation may increase price and draw the company out of business because of competition.Free-market mechanism works based on the assumption that â€Å"It is not from the benevolence of the butcher, the brewer, or the baker, that we expect our dinner, but from their regard to their own interest† (Adam Smith – The Wealth Of Nations, Book I, Chapter II, pp. 26-7, para. 12). Therefore, by deviating from self-interest, a firm who heavily does CSR may be forced out of the market. However, Friedman has left out the case of default on duty of agent i. e. what if the government cannot fulfill its responsibilities as correcting market failures and redistributing resources.If these duties are not carried out, it then can cause harm to the whole society. We can see there is a dilemma here. If the companies take those duties, its main duty will be less efficient and cannot stand in the market. On the other hand, if it does not care about these residual duties, the whole society may go down i. e. the economic cake is shrinking. Let me summarize the reasons of the Friedmanian viewpoint on why company should not conduct CSR: 1. The binding relationship between owners and executives does not allow the executives to deviate the goal of the company from maximizing returns to owners 2.Doing CSR is considered as taxation on shareholders or employees, or customers, which, in a democratic world, is a job of government. 3. Under the free-market mechanism, extra expenses arose from CSR can finally draw the company out of business All in all, the Friedmanian article produces a very strict and straight point the responsibility of companies: to maximize the return of owners. It makes companies seem like soulless machines designed to do nothing than maximizing owners’ interest. However, the idea is derived from the position of an executive, who does not have real power on decision making.Moreover, this model will only work in such a condition where the government fulfills its responsibility and the model also assumes that there is only one company is doing CSR (if others do not also do CSR then unfair competition may happen). Discussion of the ethical point of view: In contrast to the viewpoint which is supported by the Friedman viewpoint presented above and the belief that CSR and profit go together that the only responsibility of companies is to maximize profit (in general) and not to do real CSR – companies may conduct CSR if it helps to increase profit i. . CSR as a tool for profit maximization, not the true goal -, there may be good reasons for firm to deviate from maximizing profit. Firstly, I will discuss on how the Friedman viewpoint is refuted and then the latter viewpoint. Counter Friedman viewpoint From the three main reasons of Friedman viewpoint above, there are counter reasons to refute them: 1. There is a contract that binds the executive responsibility to the inte rest of the owners: Such a contract does not simply release the involved parties from others duties to other agents i. . reduce or cancel their duties to the rest of the society. This also implied a fact that executives have a special duty to the owners, which will be discussed later 2. The effective division of labour between companies and government (â€Å"taxation aspect† as an example): There are two reasons to refute this term. First, it is not the action of the executive that should be considered in this case but whether the owners would give up some of their benefits to promote other ends i. e. efute the notion that executives doing CSR as a taxation agent. Secondly, there are cases when the government cannot or not willing to do its duty, therefore, makes the whole model of ideal division of labour collapse. On the second reason, the author gives an example of Third World countries where governments are usually fail to fulfill their duties. However, this example is no t so persuasive since in such countries, not only the governments default on their duties but other agents, especially customers, do not value the CSR.Therefore, if a company assumes to take the residuals value, it will lose its competitiveness and being drawn out of business. 3. The free-market competition does not allow firms to do CSR: it is reasoned that if customers, employers, shareholders, government value the CSR activities of the firm then CSR will not push a firm out of business but conversely, can even help the firm grow. The article also criticizes the Friedman viewpoint by refute the notion that â€Å"Firm has a special duty to its owners and it should takes preference over duties to others†.A special duty may be formed: when agents have a certain kind of relation to each other (the relation approach) or the universalistic approach that everyone has responsibilities to everyone else, but these general duties can be carried out more effectively if each agent is as signed special duties, which it does best, towards a limited group. For the relation approach, the firm and the owners should have at least one of three kinds of traditions: voluntarist tradition, the mutual benefit tradition or the communitarian tradition.It seems that there is a voluntary tradition existing between the firm and the owners but it does not mean that each agent can pursue their own goal at all costs since doing so, it may harm the voluntariness of other parties. Therefore, a voluntarist tradition also restricts the profit maximization. Based on the communitarian tradition, agents are partly defined by its relationships and various rights. Therefore, reducing the commitment to a group is the same as changing the agent’s personality and that special duties should only arise from relationships that are key to the agent’s identity.Miller has created some â€Å"criteria† for such relationships: (1) they belong together, (2) their association is neithe r transitory nor instrumental, (3) their community has distinctive characteristic, (4) there is loyalty in the sense of willingness to sacrifice personal gain to advance in the interests of the company. The relation between the firm and owners has failed heavily on criteria (2) and (4) and therefore, it fails within the communitarian framework. However, it is worth questioning here about the criteria.In such a fast changing world, especially the explosion of virtual world – the Internet, communities are formed, which can satisfy all of the above criteria (for example, the open source community, who develop computer programs and peer production together without cost to the public usages) but leave no or very little traits (identity) on the parties. As the grounds for mutual benefit traditions, it is true that there is a mutual benefit tradition between firm and owners.However, it involves far more parties, who can be customers, business partners, government†¦ Therefore, t he firm’s responsibilities cannot be limited only to the owners. Nevertheless, if then, can and should the company try to satisfy all of its stakeholders. This leads us to the universalistic approach, whether the firm should have special duty towards a group (owners), which it can do most effectively. The universalistic approach is built on the assumption that agents who are assigned special duties can carry out the duties, which means that governments can effectively correct market failures and redistribute income.In practice, this is not always the case; and when the special duties cannot be done, they become the residual responsibilities of all. And it is worth notice here that division of duties is just a tool to promote the general duties. Therefore, when the government fails to perform its duty, the company should deviate from its special duty (maximize profit) and try to cover the residual duties. However, there are 2 problems with this reasoning. First of all, how can we measure if an agent has successfully performed its duty i. e. f the government has done a good job or not? Second, the residual responsibilities are rested on the entire society, not only the business. Therefore, only when other agents also try to participate in solving the responsibilities, are the general duties fulfilled. It helps to avoid the disadvantages to companies when they do CSR as mentioned in the 3rd reason of Friedman viewpoint. Only when the customers and other companies take part in the process, does the company not face the fact of being out of business due to unfair competition.In all of the relationship traditions mentioned above, the special duties of firm to owners has failed on some and partly fulfilled some. As a conclusion, the special duty of companies to owners is restricted by the duties to other agents and it may be changed (deviate from profit maximization) if necessary. CSR and profits do not always go together: It is shown, by practice’s inv estigation that CSR will not always lead to positive economic profit and there is a limit for CSR expending (to some point, the cost will be more than the benefit).However, there seems to be a lack of time variable here in the research. For example, if the company builds 10 or 100 hospital for the city, it does not lead to much different economic profit. However, if the company continues supporting 10 hospitals for 10 years then it can create a commitment between the company and the community, which then results in customers’ loyalty. The profit from CSR should not only be measured at a fixed moment but also spread through a period of time.All in all, the ethical point of view states that companies do not have special duty to only the owners but it must act in a way that can comprehend its other duties to different parties in the society and in order to do so, it may have to deviate from its ultimate goal i. e. maximizing profit. However, in contrast with the conditions for F riedman viewpoint, this assumption requires a condition where the government cannot fulfill its duty and other parties (competitors, customers, suppliers†¦) must act in the same manner as the company (deviate from their own special duties if needed). Conclusion:Both articles provide very interesting opinions on if firms should take on CSR or not. While Friedman viewpoint, which based heavily on the assumption of private-property democracy and free-market mechanism, states that firms must only focus on one ultimate responsibility: maximize owners’ return, the ethical viewpoint states that firms must also sacrifice its own self-interest i. e. profit in order to promote other ends for the society. I agree on the assumption that executives have a special duty against the owner and that efficient division of labour should be respected in normal cases.A company can never satisfy all the responsibilities it has towards all other parties equally or effectively. Only by dividing the general duties and assign them to subgroups, it makes sure they are done in the most effective way. Moreover, as an executive, if he or she tries to conduct CSR against the will of owners then the effect of such actions is neither material or long lasting since the owners, according to law, have the right to appoint and dismiss executives on their will.This assumption also implies that social responsibilities do not rest on firms but rather on individuals. It is not whether firms do CSR or not but if each of the owner wants to sacrifice their own interests for the common good. CSR, at its best understanding, involve the participation of the whole society i. e. companies do not stand alone is this field and so, should not be considered solely when debating on CSR issue. Other factors such as how the government does its duty and how customers, suppliers†¦ value the CSR have huge impact on the fact that should companies conduct CSR.Free-market mechanism is a very strong force that as long as our society depends on it, we must comfort it. Only when the customers’ demand for such CSR value increases, does the companies do CSR. If this is not the case, companies are killing themselves. Therefore, no matter how intensive firms are on CSR issue, it will be immaterial and short-sighted if by doing so, threat the firms out of business. The debating question here is not about firms conducting CSR but about how society value CSR, which will then guide the behaviours of firms.In conclusion, in current situation under the force of free-market mechanism, firms’ decisions are not the main forces that affect the CSR issues but how well other agents (especially government) fulfill their own duties and how society value CSR. The available solutions are that government must improve its performance (tighten the legislation, prevent corruption, protection for firms doing CSR†¦) and the society’s awareness of CSR value must be raised so that societ y will value CSR seriously (through education programs).Only then, can firms truly perform CSR without facing the dilemma of trade-off for economic profit, which is the main reason for firms to exist. All in all, for now, I agree to the statement of Milton Friedman that â€Å"responsibility is to conduct business in accordance with their (owners) desires, which generally will be to make as much money as possible while conforming to the basic rules of the society, both those embodied in law and those embodied in ethical custom†. The question is how such â€Å"basic rules† will drive the behaviours of companies.

Friday, November 8, 2019

Free Essays on DHCP

Although a single DHCP server can support a network of any size, it is often useful to have two. Here's what happens when a DHCP client enters the network: 1. The client broadcasts a DHCP discover message that is forwarded to DHCP servers on the network. 2. Each DHCP server that receives the discover message responds with a DHCP offer message that includes an IP address that is appropriate for the subnet where the client is attached. 3. The client considers the offer message and selects one. It sends a request to use that address to the DHCP server that originated the offer. 4. The DHCP server acknowledges the request and grants the client a lease to use the address. 5. The client uses the IP address to bind to the network. If the IP address is associated with any configuration parameters, the parameters are incorporated into the client's TCP/IP configuration. In step 1 I told you that DHCP clients request their addresses using broadcast messages. The preceding chapters have pointed out several times that broadcast messages don't cross TCP/IP routers. Does that mean that a DHCP client can't obtain an IP address from a DHCP server on another subnet? No, not if you configure routers with the BOOTP protocol. BOOTP is an older protocol that assigns IP addresses, and it remains in use to allow DHCP broadcasts to propagate across routers. Thanks to BOOTP, a DHCP server can service clients on any number of subnets. In Figure 14.17, BOOTP is enabled on the router, which must, of course, be configured to route TCP/IP traffic. When the client broadcasts a request for an IP address, BOOTP receives the request and sends a directed message to any DHCP server that it knows about. This allows a DHCP server on a remote subnet to receive the request. The DHCP server responds through a directed message, so there is no problem with routing the response back to the client.... Free Essays on DHCP Free Essays on DHCP Although a single DHCP server can support a network of any size, it is often useful to have two. Here's what happens when a DHCP client enters the network: 1. The client broadcasts a DHCP discover message that is forwarded to DHCP servers on the network. 2. Each DHCP server that receives the discover message responds with a DHCP offer message that includes an IP address that is appropriate for the subnet where the client is attached. 3. The client considers the offer message and selects one. It sends a request to use that address to the DHCP server that originated the offer. 4. The DHCP server acknowledges the request and grants the client a lease to use the address. 5. The client uses the IP address to bind to the network. If the IP address is associated with any configuration parameters, the parameters are incorporated into the client's TCP/IP configuration. In step 1 I told you that DHCP clients request their addresses using broadcast messages. The preceding chapters have pointed out several times that broadcast messages don't cross TCP/IP routers. Does that mean that a DHCP client can't obtain an IP address from a DHCP server on another subnet? No, not if you configure routers with the BOOTP protocol. BOOTP is an older protocol that assigns IP addresses, and it remains in use to allow DHCP broadcasts to propagate across routers. Thanks to BOOTP, a DHCP server can service clients on any number of subnets. In Figure 14.17, BOOTP is enabled on the router, which must, of course, be configured to route TCP/IP traffic. When the client broadcasts a request for an IP address, BOOTP receives the request and sends a directed message to any DHCP server that it knows about. This allows a DHCP server on a remote subnet to receive the request. The DHCP server responds through a directed message, so there is no problem with routing the response back to the client....

Wednesday, November 6, 2019

British Petroleum Corporate Social Responsibility

British Petroleum Corporate Social Responsibility Written by Mathew Bishop and Michael Green, Is Corporate Social Responsibility Evil explores the issue of Corporate Social Responsibility (CSR) by observing two events: the recent oil spill in the Gulf of Mexico and the melt down of financial systems in the late 2008.Advertising We will write a custom article sample on British Petroleum Corporate Social Responsibility specifically for you for only $16.05 $11/page Learn More It seeks to de-link corporate social responsibility from the two incidents in response to an article whereby Chrystia Freeland, an editor with the Washington Post, positively correlated the two. In the case of the oil spill, the article seeks to show that even though British Petroleum (BP) did go to great lengths in their CSR campaign; other firms that did not do this would have suffered the same fate because of their shallow strategy of just ensuring ‘no failure and never preparing for one.’ The article agrees that, CSR did have the effect of affording the company leniency and more time than would have been the case if their CSR were not so aggressive. It also argues that, the CSR campaign by the company had waned since it declared the need to go beyond petroleum in combating factors that lead to climate change. On the financial systems meltdown, the article admits that Goldman Sachs focused on CSR activities, which did not seem to help the firm in its advancement. The firm became unpopular due to the huge profits it made after the crisis and gave out huge bonuses to its staff not acknowledging the public for the banking industry bail out. The authors therefore argue that the approach to focus on CSR rather than its presence was wrong. In conclusion, firms need to better their CSR by engaging in better ways with the public to avoid such incidences. As the article further roll out, the need for CSR is emphasized and its advantages highlighted in different ways. Firstly, CSR need sticks out clearly in th e BP case in the way the concerned parties were able to buy more time and leniency because of being part of corporate social responsibility. Their advocacy of increased use of greener sources of energy aligned the parties for future changes and gave the impression that they care about the wellbeing of the environment and the society as a whole. Value added to products and services is one of the advantages of a well-implemented CSR plan. The regression in profits for Goldman Sachs shows a failure in their CSR approach. The article underlines the importance of efficient communication with the public in the implementation of a CSR plan. The article covers the existing literature but no new idea comes into play. However, the link between the theories of CSR and the industry practise comes out well in the analysis of these two cases. Despite the author’s articulation of the importance of CSR, the article fails to give sufficient support to the ideas that it presents. For instance, the claim that the decreased public perception on the Goldman Sachs investment firm hinged on its CSR policy is not substantiated by a research or other relevant means.Advertising Looking for article on business economics? Let's see if we can help you! Get your first paper with 15% OFF Learn More However, the ideas presented do rhyme with the given literature on the subject especially on the benefits a firm stands to gain from CSR. I do therefore agree with the article that, CSR is not an evil but a strategy that calls for proper implementation in order to reap maximum benefits. Reference Bishop, M., Green, M. (2010). Is Corporate Social Responsibility Evil? Huffpost  Business. Retrieved from https://www.huffpost.com/entry/is-corporate-social-respo_b_652054