Philosophy Of The Enlightenment - 1276 Words

The Enlightenment movement of the 18th century deeply influenced Jefferson and the other founders. The Jeffersonian Enlightenment states that liberty and equality were natural human right. The philosophy strongly influenced Jefferson’s ideas about freedom and slavery. Those who supported slavery stated that liberty was a natural human right. The Enlightenment Age major ideas were to promote a confidence in mental analysis and reason so that it would bring happiness and allow humanity to progress. Thomas Jefferson considered the Declaration of Independence as one of his greatest achievements. Jefferson saw slavery as evil, even though he continued the practice of slave ownership. Thomas Jefferson feared that if in fact the slaves were†¦show more content†¦He wanted them to change to a stationary way of life and free up the hunting grounds so white settlement could continue. I am completely against the way the Jeffersonian Enlightenment impacted policies on Native Ameri cans, African Americans, and other minorities. Although Thomas Jefferson believed he was doing the right thing, all he ended up doing was forcing Native Americans out of their homes and moving them to where he seen fit. He thought that he was securing the security of the Native Americans but only initially ended up making them angry. It is understandable how someone can agree with the way the Jeffersonian Enlightenment impacted the Native Americans, African American, and the other minorities. Jefferson was trying to secure the security of the United States but also facilitate trade and acquire land. I can see how he was actually trying to be helpful but only had Americas best interest in his mind, which ultimately ended up forcing the Native Americans out of their homes and into a totally different home. The third passage is merely covering the Indian Removal Act. I know I touched on the topic a little earlier in my essay. After the United States started demanding both political and military action to help with the removal of the Native Americans in 1829, Andrew signed the Indian Removal Act on May 28,1830. This law allowed the Natives to negotiate their removal. It was changed to aShow MoreRelatedThe American Enlightenment Philosophy784 Words   |  3 PagesThe American Enlightenment Philosophy developed for a period of almost a century starting in mid 18th century and continued till the latter parts of the 19th century. This was the same era in which the America gained independence and the nation was developing as a cohesive unit. It was on the rise and the people wanted to leave a mark o the international scene. Just like we saw an Age of Enlightenment in the European areas almost a 100 years back the same pattern was being followed and exhibitedRead MoreEnlightenment Ph ilosophy in Frankenstein Essay1882 Words   |  8 Pagesegotistic archetype as it relates to the ideals of The Enlightenment Period, a time period she sees as self-centered. Shelley sees the arrogance in the fact that Enlightenment philosophers test the limits of human understanding and attempt to simplify the ambiguities of nature. She asserts that man is egotistical to believe that he or she can completely dominate a comprehension of the human experience. In the novel, Victor Frankenstein embodies Enlightenment philosophers as a man possessed by a drive to understandRead MoreTo What Extent Was The Enlightenment The Main Driving Force Behind The American And French Revolutions?1479 Words   |  6 Pagesextent was the Enlightenment the main driving force behind the American and French Revolutions? The years 1685 to 1815 (Strayer, 2011) will be the focus of this investigation to allow for an analysis of the Enlightenment ideas’ impact the need for governmental change in the American colonies and France during the eighteenth century, as well as their governmental influences post-revolutions. †¯ The first source which will be evaluated in depth is the Stanford Encyclopedia of Philosophy, last editedRead MoreEssay on Revolution in Scientific Affairs977 Words   |  4 Pagesled to the idea that the universe was similar to a mechanical device which had been put in motion by God or a similar â€Å"First Cause,† who no longer took action in the universe. This idea, called Deism, would play a major role in the ideas of the Enlightenment thinkers such as Voltaire and Diderot. However, it was a Frenchman who felt he had proven God’s existence who would provide the philosophical framework for the Enlightenment’s questioning of religion and tradition. Renà © Descartes took Bacon’sRead MoreEnlightenment and Puritans782 Words   |  4 Pages The Enlightenment period, also known as The Age of Reason, was a period of social, religious, and political revolution throughout the 18th century which changed the thoughts of man during this â€Å"awakening† time. It was a liberation of ignorant thoughts, ideas, and actions that had broken away from the ignorant perception of how society was to be kept and obeyed thus giving little room for new ideas about the world. Puritan society found these new ideas of thought to be extremely radical in comparisonRead MoreThe French Revolution And The Revolution1640 Words   |  7 Pagesevents in world history (Voices 9). The surge of rebellion present in those against the old regime, or Ancien R à ©gime, inspired reformers for generations to come. Nevertheless, the French Revolution would not have occurred without the aid of the Enlightenment Thinkers, or Philosophà ©s. These Philosophà ©s’ ideas sparked the French Revolution. Prior to the French Revolution, France was radically different. It was the state of France before the revolution that the Philosophà ©s owe their effectiveness toRead MoreThe Political, Economic and Social Aspects of the Enlightenment1109 Words   |  5 PagesThe Political, Economic and Social Aspects the Enlightenment The Enlightenment, also known as Age of Reason, was a cultural movement that spread through England, France, Germany, and other parts of Europe. The Enlightenment mainly focused on mathematics, science, art, philosophy, politics and literature in the 1700s. This movement took away the fear of the world and the medieval views that were placed upon the people for so many years, and it also opened their eyes to new ideas and reason. OldRead MoreKant s Theory On Personal Enlightenment1196 Words   |  5 PagesTariq Al-Bakri Dahlia Guzman PHI1103.006 12/04/2015 Kant’s theory on personal enlightenment Immanuel Kant is definitely one of the most pivotal thinkers in the history of philosophy. His enlightenment theory has become well-known throughout the world and at the same time it immortalized the name of this great German philosopher. Kant defined enlightenment as ability of man to use his own understanding without guidance from another and hence to escape from his self-imposed immaturity. According toRead MoreThe Enlightenment Puritanism Essay807 Words   |  4 Pages The Enlightenment period, also known as The Age of Reason, was a period of social, religious, and political revolution throughout the 18th century which changed the thoughts of man during this â€Å"awakening† time. It was a liberation of ignorant thoughts, ideas, and actions that had broken away from the ignorant perception of how society was to be kept and obeyed thus giving little room for new ideas about the world. Puritan society found these new ideas of thought to be extremely radical in comparisonRe ad MoreEssay on The Enlightenment1246 Words   |  5 Pagesthat combine, interact, and, at various intervals, take pervasive shifts. The Enlightenment of the eighteenth century was one of these paradigm historical shifts, challenging the traditional notions of authority by investing reason with the power to change the human condition for the better. This ecumenical emphasis on reason and independent thought led to an explosion of change and development across science, philosophy, religion, and politics. Later ideologies that would shape the socioeconomic

Borderline Personality Disorder A Case Study and...

According to the DSM-5, Personality Disorders are characterized by â€Å"impairments in personality functioning and the presence of pathological personality traits†. Borderline Personality Disorder is one of ten personality disorders listed in the DSM-5. The DSM-5 lists several criteria that must be met in order for someone to be diagnosed with Borderline Personality Disorder. They are quoted as follows: Borderline Personality Disorder (BPD) affects about 4% of the general population, and at least 20% of the clinical psychiatric population. (Kernberg and Michels, 2009) In the clinical psychiatric population, about 75% of those with the disorder are women. BPD is also significantly heritable, with 42-68% of the variance associated†¦show more content†¦The next morning, MMM was introduced to her inpatient Psychiatrist. MM mentioned to her Psychiatrist that she had battled symptoms of depression throughout high school and had thoughts of harming herself, especially after a relationship would end. The ending of a relationship would be followed by feelings of abandonment, like the feelings she had as a child when her father left. She also expressed to her Psychiatrist that she felt that she was not loveable and that she would be alone the rest of her life. She expressed resentment towards her father for leaving, and towards her mother for making him leave. She even expre ssed resentment towards her ex-boyfriend, whom the recent suicide attempt was over, but stated that she would take him back in a heartbeat. In fact, she stated that she hated him, but couldn’t live without him. The Psychiatrist listened to MMM carefully, and diagnosed her with Borderline Personality Disorder. He recognized the common statement made by those with Borderline: â€Å"I hate you, please don’t leave me†. MMM was released after 72 hours into an outpatient program where she was assigned to a group therapy circle for those suffering from Borderline Personality Disorder. She also signed up for individual therapy with a therapist on-campus specializing in the treatment of Personality Disorders. It is up to MMM to follow-up with her treatment plan. Because her suicide attempt occurred on campus, the Dean of StudentsShow MoreRelatedTypes Of Problems Theory Of Psychology2025 Words   |  9 PagesTypes of Problems Theory that is most Useful Practitioners also use various types such as psychodynamic (and psychoanalytic) theory and therapy in the arena of behavior to tracking various aggressive problems. â€Å"This is one of the oldest theories of psychology in which patients are viewed within a model of illness or what is lacking. Individuals in theory can be seen as being made up from a dynamics that begins in early childhood and progresses throughout life. Sansone, Wiederman, HatticRead MoreMedical Health Promotion And Disease Prevention Plan1467 Words   |  6 Pagesindicated that mental health disorders are the leading cause of disability in United States and Canada, while suicide is the 11th leading cause of death that killed approximately 30,000 American each year (â€Å"Mental Health and Mental Disorders†, n.d.). The United States Preventive Services Task Force (USPSTF) has commended series of guideline once patients are identified with mental health disorder. According to the flow chart, the treatment plan for major depressive disorder include provide pharmacologicalRead MoreBorderline Personality Disorder And Insecure Attachment2065 Words   |  9 Pages Borderline Personality Disorder and Insecure Attachment Melanie Countee Marymount University â€Æ' Abstract Borderline Personality Disorder is marked by maladaptive personality traits including chaotic interpersonal relationships, poor impulse control, and emotional instability. Theorists and clinicians have suggested that attachment based theories provide a framework to understanding and assessing BPD etiology. Links between insecure attachment along with abuse and neglect are relevant casualRead MoreA Research Study On Behavior Theory2552 Words   |  11 Pageslong-term changes, fashioning design treatment strategies to individual clients, rigorous assessment and evaluations. The two practitioners this paper shall primarily focus on the studies of B. F. Skinner and Albert Bandura. With the support from several other scientific studies of development of learning theories making, this study is made to be a little difficult with the so many diversified views sometimes overlapping. Corey, (2013). While, behavior theory practitioners focus regularly and straightforwardlyRead MoreApplica tion Of Theory Guidelines1693 Words   |  7 Pagesthat mental health disorders are the leading cause of disability in United States and Canada, while suicide is the 11th leading cause of death that has killed approximately 30,000 American each year (â€Å"Mental Health and Mental Disorders†, n.d.). The United States Preventive Services Task Force (USPSTF) has recommended a series of guidelines to follow once patients are identified with mental health disorders. According to the flow chart, the treatment plan for major depressive disorders includes pharmacologicalRead More The Effects of Sport on Levels of Mindfulness and Experiences of Flow: A Comparison of Contact, Non-contact and Team, Non-team Activities1695 Words   |  7 Pageswith problematic situations (Linehan, 1993). In addition to this, research revealed that those who undergo mindfulness training also experience improved ability to sustain attention in the present moment (Marks, 2008). From a similar stance, recent studies carried out by sport psychologists provided an indication towards a relationship between aspects of mindfulness and sporting performance, in which theories of ‘flow’ and ‘peak performance’ were evidently compatible with the constructs of mindfulnessRead MoreManaging A Group Of Intimate Partner Violence1576 Words   |  7 Pagescope with the stresses of the actual actions of abuse, but also the stresses associated with the courts. The goals can help group members reach a level of self-awareness. The goals do not exclude anyone out of the group. For example, there may be cases that there are women offenders coming to the group. Group format The format of the group will be educational which can be helpful to group members (Corey et al., 2014). A group leader may need to help group members address any beliefs that couldRead MoreThe Medical And Behavioral ( Dsm ) Community1943 Words   |  8 PagesThe medical and behavioral (DSM) community has chosen to let go of the more shadowy term â€Å"Gender Identity Disorder,† in favor of a less charged and hopefully more suitable term, â€Å"Gender Dysphoria,† for transgender individuals. This paper will explore conventional clinical perspectives and subsequent changes therein; survey a few theoretical frameworks, both conventional and more post-modern, in order to gain a better understanding of how to effectively work with gender dysphoria. The main body ofRead MoreCognitive Behavior Therapy ( Cbt )2370 Words   |  10 PagesWhilst Cognitive Behaviour Therapy (CBT) is currently the dominant form of psychotherapy, there has recently been an increase in interest i n acceptance and mindfulness based approaches within the field of behaviour therapy. This has led to considerable debate over the relative efficacy of each therapy, whether they are more similar or distinct to one another, and the strengths and weaknesses of each approach. These three questions will be considered specifically with respect to the CBT developedRead MoreCulturally Adapted Acceptance And Commitment Therapy For Treating Depression Among Latino Adults9015 Words   |  37 PagesCULTURALLY ADAPTED ACCEPTANCE AND COMMITMENT THERAPY FOR TREATING DEPRESSION AMONG LATINO ADULTS by Lucerito E. Ruiz Ramirez, M.S. A Dissertation Submitted in Partial Fulfillment of the Requirements for the Degree Doctor of Psychology UNIVERSITY OF LA VERNE College of Arts and Sciences Psychology Department Month and year dissertation is completed Copyright  © (year submitted) Lucerito E. Ruiz Ramirez All Rights Reserved CULTURALLY

Herpes Essay Research Paper HerpesHerpes has been free essay sample

Herpes Essay, Research Paper Herpess Herpes has been around for a really long clip. So long that it really likely predates the human species. # 8220 ; Herpes # 8221 ; derives its name from the Grecian word herpein, which means to crawl or creep. The doctors of Greece, handling herpes over 2,000 old ages ago, described herpes of the oral cavity and herpetic sores in the inguen, which traveled around the wing and venereal parts. Throughout history many a physician attempted to understand the herpes virus. Due to similarities amongst assorted herpes viruses, it was hard to name which virus was responsible, as symptoms varied yet remained similar. Today herpes has become one of the most common viral infections, found in every societal and economic category. Modern engineering has farther enabled us to sort the assorted herpes viruses. Research in the late 60 # 8217 ; s revealed herpes of the oral cavity, Herpes I, and herpes of the venereal part, Herpes II, as two really distinguishable herpes viruses. There are two herpes viruses. Herpes type one is normally called cold sores or febrility blisters. These are found near the oral cavity. Gingivostomatitis, another signifier of herpes normally caused by HSV-1 is characterized by lesions on the interior of the oral cavity and pharynx ( little painful ulcerations ) . Type two is called Genital Herpes by and large occur below the waist. For adult females, symptoms show up in the vulva, vagina, and neck. For work forces, symptoms by and large show up on the phallus ( the prepuce or penile shaft ) , and environing genitalia country. Herpes is spread by direct skin-to-skin contact. Unlike a grippe virus that you can acquire through the air, herpes spreads by direct contact, that is, straight from the site of infection to the site of contact. For illustration, if you have a cold sore and snog person, you can reassign the virus to his or her oral cavity. Similarly, if you have active venereal herpes and have vaginal or anal intercourse, you can give your spouse venereal herpes. Finally, if you have a cold sore and set your oral cavity on your spouses genitalias ( unwritten sex ) , you can give your spouse venereal herpes. Herpes is most easy spread when a sore is present, but it is besides frequently spread at other times excessively. Some people notice rubing, prickling or other esthesiss before they see anything on their tegument. These are called # 8220 ; Prodromal Symptoms # 8221 ; and they warn that virus may be present on the tegument. Herpes is most likely to be spread from the clip these first symptoms are noticed until the country is wholly healed and the skin looks normal once more. Sexual contact ( unwritten, vaginal, or anal ) is really hazardous during this clip. Sometimes those who know they are infected spread the virus between eruptions, when no marks or symptoms are present. This is called # 8220 ; Asymptomatic Transmission. Research besides shows that people who don Ts know they are infected frequently dispersed herpes simplex infections. These people may hold symptoms so mild they don # 8217 ; t detect them at all or else wear # 8217 ; t acknowledge them as herpes. Many venereal herpes infections are spread from individuals who are symptomless # 8220 ; Shedders # 8221 ; of the virus. For those who recognize their symptoms, symptomless transmittal appears to be far less likely than spr eading the virus when lesions are present. Many twosomes have had sexual dealingss for old ages without conveying herpes. Some merely avoid holding sexual contact when marks or symptoms are present. Others use rubbers, gelatins or other protection between eruptions to assist protect against symptomless sloughing. Besides retrieve that new information has come to the head, which is really distressing. The New England Journal of Medicine reported on October 16, 1997 that merely 10 % of persons who tested positive for Herpes II were cognizant they had the disease. The hazard of catching herpes after a individual sexual contact with an septic spouse is non known, but more frequent contact with person transporting venereal herpes consequences in a greater than 50 percent opportunity of the virus distributing to you. My Treatment If you believe you are holding an eruption, this is the best clip and the lone clip, you can cognize for certain whether what you have is in fact herpes. The following measure is to acquire look into out by your private physician if you can see him right off. If you don # 8217 ; Ts have a personal physician, so see your wellness attention installation as a walk-in or exigency patient in order to be tested every bit rapidly as possible. What they are traveling to make is to take a viral civilization if you have symptoms present. Rubing a swab over the lesions to roll up virus does this. This is a really easy and painless procedure. Extra trials can be performed to find if you have herpes and farther indicate which herpes virus you are covering with. These trials are called Cell Culture Test, Antigen Test and a Pap vilification for the adult females. Overall the most of import thing is to be tested! Signs of herpes, or symptoms can change from individual to individual. However, the mean individual can by and large acknowledge his or her symptoms. They stand as a utile tool to remain outbreak free. But the preliminary symptoms are called prodromic symptoms. These symptoms are obvious symptoms and are called eruptions. Outbreaks appear as: In Herpes I # 8211 ; we see seeable marks in the signifier of cold sores or febrility blisters on the oral cavity. In Herpes II # 8211 ; we see seeable marks as bunchs of blisters that break and crust to organize strikebreaker in the venereal country. Symptoms are really much like reading your temperature from a thermometer. Most of the clip we are in the normal scope, outbreak free. Then all of a sudden the temperature rises a few grades and we are alerted that things are heating by sing prodromic symptoms. Hopefully, before things get excessively hot we can make something to guard off ( suppress ) an eruption. If we are unsuccessful in guarding off an eruption, the outbreak rhythm begins. This mending rhythm can last anyplace from a few yearss to two hebdomads. Why are prodromic symptoms of import? These are the first marks that an eruption is brewing things are heating up. Prodromal symptoms appear as a skin esthesis, such as combustion, prickling, rubing, or prickling, with no evident physical cause. Tingling is the most common of prodromic symptoms for both Herpes I and II. This once more is the clip to acquire tried! So be smart and responsible and acquire tested.

Scalping and market clearing Essay Example

Scalping and market clearing Essay Market clearing according to the classical economist involves the process of adjusting prices in order to achieve equilibrium price and quantity, this is a situation whereby the quantity demanded will equal the quantity demanded, and this point will give us the equilibrium price and also equilibrium quantity. When the market is not at equilibrium there is need to adjust the price so as to achieve the equilibrium, this is what is referred to as market clearing. [1] However the market is not always at equilibrium and market forces such as the demand and supply adjusts its self automatically, this is given by the law of demand and supply where when the quantity demanded is high then the level of prices rises and therefore the demand declines, when supply is high then prices will go down discouraging suppliers and therefore adjusting quantity supplied.[2] Scalping involves the process of recommending high prices on a security or in our case tickets shortly after having acquired the tickets at a lower price and when the prices go up the individual will sell the ticket at a high price and therefore make a profit. Sporting event tickets: We will write a custom essay sample on Scalping and market clearing specifically for you for only $16.38 $13.9/page Order now We will write a custom essay sample on Scalping and market clearing specifically for you FOR ONLY $16.38 $13.9/page Hire Writer We will write a custom essay sample on Scalping and market clearing specifically for you FOR ONLY $16.38 $13.9/page Hire Writer In our case all tickets for a stadium have been sold at a price lower than the normal market price, in this case there is need for market clearing in order to shift the market is not at   equilibrium, the following diagram shows the case where all the tickets have been sold at a lower price than the equilibrium market price: nbsp; From the above diagram the equilibrium price is Pe and the equilibrium Quantity is Qe, however the tickets were sold at a lower price than the equilibrium price, in this case the price was P1 and the quantity demanded was Q1, excess demand was Q1 minus Qe, the price was lower by Pe minus P1, the equilibrium point determines the equilibrium price and equilibrium quantity, the equilibrium point is the point where the supply curve will intersect with the demand curve and in our case it is Qe and Pe. Scalping: In the case where there is scalping, ticket holders will gain in the process, due to the high demand the price of tickets will rise, people will tend to buy the tickets at high prices, the ticket holders will therefore gain in the process whereby they will sell their tickets at higher prices than the price they originally bought them, the diagram below shows the process of scalping and the total gain.[3] In the above diagram Pe represents the equilibrium price and also Qe represent the equilibrium quantity, Pa in diagram 2 represents the price after Scalping, this price after scalping is quite high than the original price the holder of the tickets had acquired them, this price therefore will lead to profits to the ticket holder. The values of profit the ticket holder will get is the difference in buying price and selling price and multiply that with the number of tickets bought, as a resulting of scalping the holders o the ticket ill get a profit and those who buy later will loose by buying at a very high price. Scalping is the process of making value out of creating demand for goods and services, the value of tickets is made to rise by the increased demand of these tickets, the profit will be to the ticket holders and the loss will be to those who buy the tickets after the prices have gone up.[4] The process of scalping is termed as illegal by many governments because it involves enticing people to buy by creating a situation that people will prefer certain goods and services as to gain value in the near future, as people demand the goods and services the prices goes up as the law of demand depict that as the demand of a commodity increases the prices will rise because the demand will exceed quantity supplied. The market however has its own automatic adjustment mechanism whereby as the demand raises the price rises and when the price rises demand goes down.[5] Conclusion: Scalping is a process of recommending high future prices on a security or in our case tickets shortly after having acquired the tickets at a lower price and when the prices go up the individual will sell the ticket at a high price and therefore make a profit. Market clearing is the process of adjusting prices in order to achieve equilibrium price and quantity, this is a situation whereby the quantity demanded will equal the quantity demanded, and this point will give us the equilibrium price and also equilibrium quantity. When the market is not at equilibrium there is need to adjust the price so as to achieve the equilibrium, this is what is referred to as market clearing. In the case where tickets were all sold at a low price than the equilibrium price level, it is clear that the price will eventually rise as demand for this tickets rises, when this happens the ticket holders have the opportunity to make profit from the difference in the price levels which give them this opportunities, therefore the ticket holders will gain while those who buy the tickets after the rise in price will loose.

Telecommunication Industry free essay sample

In the old days, the telecom industry was viewed as an example of â€Å"natural monopoly. † This was due to increasing returns to scale, where the telecom services could only be provided efficiently by a monopoly provider. In the U. S. , this pattern started many years ago when the American Bell Telephone purchased the Western Electric Company of Chicago. Alexander Graham Bell patented the telephone in 1876 and formed Bell Telephone. ATT, which is today one of the leading company in the wireless telecommunication industry, was formed in 1885 to connect the Bell Companies. In 1913, ATT agreed to become a regulated monopoly. Although their monopoly was allowed, they were required to connect competing local companies and let the Federal Communication Commission to approve their prices and policies. In January of 1982, ATT agreed to break itself into a national long-distance carrier and seven â€Å"baby bells† in order to end the long-running antitrust suit by the U. We will write a custom essay sample on Telecommunication Industry or any similar topic specifically for you Do Not WasteYour Time HIRE WRITER Only 13.90 / page S. Department of Justice. The break occurred in 1984. At the time of the breakup of ATT, almost all telephone companies were monopolies and the increased growth toward competition The cost reductions have made access to the Internet affordable to the general public. However, in the wireless market, while more people are able to get new devices, companies may try to cap their data usage. For example, at Verizon, they changed their data plans from unlimited usage to capped plans. This is â€Å"partially due to rising bandwidth costs from data-hungry subscribe, making the switch to tiered plans inevitable. Network expansion is another area of the wireless sector that can lead to transactions costs. A good example is Sprint plans to expand its network from the WiMax to the LTE, which is expected to take place in 2013. All main competitors already are into the LTE network. This switch â€Å"is expected to cost Sprint $4 and $5 billion, though the investment could deliver over twice that in economic benefit to the company, if this bet pays off better than the money it put on WiMax did. † Through this example we can see how there are most than just the cost of expanding the network itself, but anything else that is involved until its completion.

How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essays

How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essays How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essay How does the temperature of a squash ball affects the impact time of the ball drops from a certain height Essay If is greater with impact time being constant, the average must be greater. When temperature of the squash ball is low, it is quite soft and easy to be deformed. The impact time is hypothesized to be longer. As temperature increases, the squash ball will become more rigid and deform less. The impact time is hypothesized to be shorter. Since, when the impact time is smaller with net force being constant, the average force must be greater. Therefore, with the two effects, the average force of the impact is hypothesized to be greater when temperature increases.Method and materials.Experiment (a)Since there is originally no any equipment that can measure the extremely short impact time, therefore I had to develop several ideas to measure the time. These are the six possible solutions:1. Stroboscopic photosThe negative is put under long exposure. And the experiment is supposed to be performed in a dark room otherwise the negative will be over expose. Stroboscope is needed to give the flas hes at a very high frequency. Under which, the images of the falling ball including the impacting period will be taken. We will then count the numbers of images that are touching the ground (impact period). With the frequency shown on the stroboscope, we can then calculate the impact time of the squash ball.However there is limitation of the experiment. The impacting images may pack too close to each other that we cannot distinguish the number of them and fail to calculate the correct value.Moreover stroboscopic photos are difficult to be taken well. It requires skill to control the exposure so that the photos taken will not be too bright or too dark for observation. Therefore the suggestion was abandoned.2. Ultrasonic position sensor (UPS)Place a UPS on the ground; drop the ball from certain height to it. The UPS is connected to a computer for receiving data. A graph of distance against time will be plotted automatically. By observing the length of time when the distance is at zero , we can know the impact time of the ball.However, later I acknowledged that the speed of the ultrasonic waves is not fast enough to measure the fast dropping object to give accurate results. Therefore the suggestion was abandoned.3. Conduction sensorFix a piece of foil on a dense plate (cutting board), on the surface place another piece of foil closely but without touching the first one. Both foils are connected to a scalar timer with wires. The ball is then dropped onto the upper foil, pressing the foil and closing the circuit. When the ball rebounds, the upper foil releases and disconnects the circuit. The impact time can be indirectly collected from the conduction time. As this experiment was easier to perform, I used the set up to find a rough impact time of about 0.01s~0.05s. This result can be then used as a assumption value for other suggestion.However, it was suggested that the upper foil may obstruct the falling speed of the ball. This leads to an experimental error of the results. Moreover after the ball rebounds and leaves the upper foil, the foil may still in touch with the lower foil due to deformation. The impact time we get may be over estimated.4. Light sensorSet up a light sensor on the table with the light beam just situate above the table surface. Then drop the ball to cut the beam. The time that the light sensor obtains is the impact time.However, as the light beam has finite thickness, it is not accurate enough to measure the impact time. The ball may cut the beam too early and leave too late which over estimate the impact time. Furthermore, it is difficult to ensure the ball drop exactly to the light beam by its lowest point. The results may not be accurate.5. Formula and calculationFirst we need to measure the dropping height, e.g. A cm. Then we drop the ball and at the same time start to count the time using a timer. When the ball rebounds to the highest point we stop the timer and at the same time record the highest point it reaches, e.g. B cm. let the total time for the process be C seconds. From the formula s=ut +(1/2) at2. We then substitute distances B and C to find out the time need for dropping and rebounding.But deficiencies are still being found for this alternative. There is reaction time error in working the timer. The reaction error is even larger than the impact time. Also, the highest point the ball reaches may not be accurately detected. So the measurement is considered not working.6. Digital-video camera approachUse the camera to take the impacting images of the ball. Then replay the film to find out the time of impact. As we found out that the impact time is around 0.03Final decisionAfter series of consideration, I made the final choice to use the option 3. Despite its limitation that may lead to over estimation of results, I found the problems that may occur in No.3 least essential. Moreover stretching the upper foil a little can reduce the deformation of the upper foil. So this measuring method was selected.Experimental set up.In the experiment I prepared the following material for the setting up.MaterialsKettle, clamp, chopsticks, squash balls, stand, towel, scalar timer, aluminium foil, aluminium tape, plastic tape, wire, clips, cutting board, a pack of unused paper card.MethodsFirst of all, Impact Time Measuring Device (ITMD) was made as core of the set up:Aluminium foil was stuck to the cutting board until its upper surface was completely filled up by the tape. I then check the conduction of the foil to ensure no gaps between each strip of tape. Then an 8x8cm2 hole was made from 10x10cm2 paper card. A piece of 8x9cm2 foil was then stretched on the middle of the hole. Then I used tape to fix the foil on two ends of the hole. The paper card with the foil on top was put onto the upper surface (with foil) of the cutting without the two piece of aluminium touching each other. Then both foils were connected to two separated wires with crocodile clips and the wires were conn ected to the scalar timer. The ITMD was finished.In order to test if the ITMD was reliable, I performed several dropping test for checking. Firstly I dropped the ball at room temperature of height 140 cm; unfortunately the results each time collected were not consistent. They had differences of about 50% to 200%. Therefore I changed the setting of the paper card. I used a larger piece of foil (99 cm2) and stretched it to the four end of the paper hole. The later tests showed improvement as the differences drop to about 20% to 60%. And I thought that it may due the deformation of foil that the two foils still pressed to each other when the ball left. So I stuck another piece of paper card with hole just right beneath the original one. It was done to increase the distance between the two foils by about 0.5mm so that they are more likely to separate after the ball has left. The tests followed were more coherent as their differences were just about 10 % to 20%. Then I varies the droppin g height to see if the measurer could detect the time different (room temperature). It showed an increasing trend of impact time when the dropping height increase. That proved that it senses changes.The kettle was then used to boil the water for heating up squash balls; however it is not convenient to do in this way, so I changed to use a water bath instead. With the water bath, I could then adjust the temperature I want easily. Clamps were used to release the balls instead of the chopsticks. Firstly stand with clamp were put on the lab table. I measured 130 cm from the bottom of the ball in the clamp vertically to the centre of the cutting board. Then the squash balls were first immersed into water of 20.2oC for 10 minutes to ensure the balls were have same temperature as water. Then I used the clamp to take one from the water bath, quickly dried it with towel and transferred to the clamp on the stand, released it to the centre of the paper. Then I repeated the procedure by another nine times to collect ten data at that temperature. In between, I recorded the impact time from the scalar timer. After that I continued the experiment with an increase of 10 oC until it reached 100 oC. For the handling of hot balls, working gloves were needed.Experiment (b)MaterialsClamp, squash balls, stand, towel, scalar timer, aluminium foil, aluminium tape, plastic tape, wire, clips, cutting board, a pack of unused paper card, water bath, working gloves.1. Same platform (cutting board with paper card) in experiment (b) was used to make the condition of two experiments more constant. Pieces of blank papers were first placed along the drop ping track of the ball on the side of the lab table. The balls were taken from the water bath of the temperatures as Experiment (b), dried, transferred to clamp and dropped to the cutting board quickly. The highest points it reached after the rebound were marked onto the papers. I repeated ten times for each temperature. Finally measuring tape was used to measure the rebound height of each temperature.Data CollectionDropping Height=130.0 + 0.1cm1. Temperature=20.2 + 0.4 o CTrial12345678910MeanRebound height/cm1818.218.218.418.418.418.618.8191918.5+0.2Impact time/0.001s191920202020212224240.0209Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (18+18.22+18.43+18.6+18.8+192)/10 = 18.5 cm + 0.2cmUncertainty =Mean impact time =Uncertainty =2. Temperature=30.0+0.4oCTrial12345678910MeanRebound height/cm27.227.427.427.427.827.828.428.428.628.627.9Impact time/0.001s161920202021222324240.0209Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (27.2+27.43+27.82+28.42+28.62)/10 = 27.9 + 0.2 cmUncertainty =Mean impact time = (20.9 + 1.3) 10-3sUncertainty =3. Temperature = 40.0+ 0.4oCTrial12345678910MeanRebound height/cm35.835.836.336.436.436.436.436.436.636.836.3Impact time/0.001s1719202121212222232421Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (35.82+36.3+36.45+36.6+36.8)/10 = 36.3+0.2cmUncertainty =Mean impact time =( 21+1.1) 10-3sUncertainty =4. Temperature = 50.0+0.4oCTrial12345678910MeanRebound height/cm4144.644.844.844.844.8454545.445.644.6Impact time/0.001s1819191920212223232420.8Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (41.0+44.6+44.84+45.02+45.4+45.6)/10 = 44.6+ 0.7cmUncertainty =Mean impact time = (20.8+0.9) 10-3sUncertainty =Trial12345678910MeanRebound height/cm51.651.851.8525252.252.252.652.65452.3Impact time/0.001s1719192021212121222320.45. Temperature = 60.0+0.4oCUncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (51.6+51.82+522+52.22+52.62+54)/10 = 52.3+0.4cmUncertainty =Mean impact time = average time = (20.4+0.9) 10-3sUncertainty =6. Temperature = 70.0+0.4 oCTrial12345678910MeanRebound height/cm60.460.660.661.661.861.862.662.662.863.261.8Impact time/0.001s1619192020202121222420.2Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (60.4+60.62+61.6+61.8+62.62+62.8+63.2)/10=61.8+0. 4cmUncertainty =Mean impact time= average time = (20.2+1.3) 10-3sUncertainty =7. Temperature = 80.0+0.4 oCTrial12345678910MeanRebound height/cm6868.869.269.269.870.670.871.672.673.670.4Impact time/0.001s1717182121212222232320.5Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (68.0+68.8+69.2+69.8+70.6+70.8+71.6+72.6+73.6)/10 = 70.4+0.9cmUncertainty =Mean impact time = average time =( 20.5+0.8) 10-3sUncertainty =8. Temperature = 90.0+0.4 oCTrial12345678910MeanRebound height/cm74.674.876.8777777.677.877.878.478.877.1Impact time/0.001s161920202021212223251.4Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (74.6+74.8+76.8+772+77.6+77.8+78.4+78.8)/10 = 77.1+0.7cmUncertainty =Mean impact time = average time = (20.7+1.4) 10-3sUncertainty =9. Temperature = 100.0+0.4 o CTrial12345678910MeanRebound height/cm8080.880.881.48282.682.882.883.48482.1Impact time/0.001s1920202020232121212521Uncertainty of height=0.1cm Uncertainty of time=0.001sMean height = (80.0 +80.82+81.4+82+82.6+82.82+83.4+84)/10 = 82.1+0.6cmUncertainty =Mean impact time = average time =(21+0.9) 10-3sUncertainty =ObservationThe size of the squash ball increased as temperature increased.At high temperatures ;80 oC, the surface of the squash ball became rough as some of the rubber skin of the squash ball was boil away.AnalysisThe impact time against the temperature:Unlike my hypothesis, the result of the impact time of the ball showed no obvious change when temperature increased. Moreover the pattern of the trend was not the way I thought where it was hypothesized to increase as temperature increase.The graph of rebound height against temperature:The rebound height showed obvious increase as temperature. The results fit with the hypothesis. The rate of increase of rebound height was quite constant from temperature 20 o C to 80 o C. Then it started to decrease from temperature 80 o C to 100 o C.At the time of impact, the force diagram of the ball is like this:There were two forces acting on the ball, one is the normal force acted by the ground, the other one is the gravitational force acted by the earth. Since net force of the ball, therefore the force acted by the groundTemperature of squash ball / o C20.230405060708090100Average force acted on the squash ball by the ground /N7.98.48.79.19.59.910.110.210.2From the graph of force acted on the ball against temperature. I found that the highest increase rate of force occurring at temperature at around 20-30o C, high increase rate continued from 20-65 o C. The rate of increase slowly decreased as it approached temperature greater than 70 o C and finally showed no change around 100 o C. By drawing a line of symmetry from the top of the trend line, we could observe that the highest average force the ground acting on the ball to be about 10.2N.DiscussionAverage forceAs stated , the graph showed a maximum average of ~10.2N. It suggested that if the velocity of the squash ball is hold constant, the average fo rce that can be exerted to a squash ball by a stationary impacting surface will be at maximum when temperature around 95o C.However the average force will not drop to zero when temperature drops to absolute zero. Since the average force acted on the ball by the ground , it is always ;0 because the velocity of the ball is changing. According to the Newtons first law of motion, every body continues on it state of rest of uniform speed in a straight line unless acted on by a nonzero force. At the point of impact, the ball accelerates upward. The only force that points upward is the normal force by the ground. Although there may be a possibility that the ball drops and sticks to the ground at extreme low temperature, causing the ?t to be infinite, but still there is the opposing force acts by the ground again the weight of the ball. So the average force by the ground must at least equal to 9.810.023 which is ~0.23N.In addition, the rate of increase of average force acted by the ground i s believed to fall at the lower temperature. As shown in the graph above, the trend line is pointing toward zero at temperature-273. We have explained that the trend will not be zero even when the temperature is -273. One possible way will be a turning point located somewhere between -273 to 20o C. And if there is a turning at that certain point, the rate of increase must be lower at that point.Rebound heightThe rate of increase of rebound is quite constant until at 80 o C it decreased. Theoretically the trend line will approach 130cm when temperature goes to infinity. However it is not possible because squash ball will melt at high temperature. For the low extreme, the squash may not rebound properly as the low temperature may constrict the plastic layer of squash ball, making it deforms, losing it quality. It is just a prediction and is difficult to perform in the school lab.Impact timeThe impact time showed no relation with the range of temperature set for experiment. The set up may not be sensitive to sense the different.Relation of force and energy at the impactThe potential energy of the ball was changed to kinetic energy before the impact; some of the energy was lost to the air friction. At the impact, some of the kinetic energy was transferred to heat energy of the ground and the ball. Some of it was transferred to the sound energy. It lost his energy and rebounded to a lower height. Those energy did lose in the impact was transferred to build up the shear modulus (elastic energy) of the ball. The greater the elastic energy is the higher the ball rebound.Evaluation of the experimentThe experiment was considered successful as the data showed a direct relationship between average force and temperature of the squash ball and a decreasing rate of increase of average force when the temperature increases. However the impact times collected were about the same which contradicted to my hypothesis. They were not even in sequence. That may due to the deficiency of the experimental set up. The foils might still connect together a short time after the ball had left. Although the time is short compared to the impact time, it changed for every impact. Therefore the impact time I got was not in a trend but about the length. it may also due to the insensitivity of the set up. After all I still managed to get the approximate impact time for the calculation of average force.For the rebound height experiment, it was quite good. There was little problem such as the imprecise way of recording rebounding height by using eye observation.On the whole, there were many systematic errors in both experiments that may affect the results. For examples, the size of the ball increased as temperature increased, it might have increased the impact time of the ball due to larger impacting area. It was possible to be the reasons for the unsuccessful for the impact time results. This might also affect the rebound height of the experiment.The foil on the cutting board reduced the velocity before impact. It might have reduced the rebound height and the impact time of the ball. The average force might have been over estimated or under estimated depends on the extent of reduction of the rebound height and impact time.Heat lost rate increased as temperature of ball increased. That suggested that the rebound height should be at the lower temperature. The rebound heights were over estimated for the higher temperature. The impact times were also affected in a certain degree.ImprovementRenew the upper foil whenever it deforms to avoid over estimation of impact time. However it may be inconvenient.Change to another method in measuring the impact time. e.g. light sensor.For the measuring of the rebound height, we can ask a partner to observe the rebound ball at the same level to improve accuracy. We can also do more repetitions for more data.Drop the squash balls directly without transferring them to the clamp on the stand. However high delicacy is need t o ensure the dropping height is right and not initial force is applied to the ball.ConclusionThe results of the experiment stated that there are changes of average force acted on the ball by the impact surface with the velocity of ball hold constant. The maximum average force will be reached at temperature around 95oC. This proved that the hypothesis to be true. However the hypothesis for the impact time was not proven to be true as the set up was appropriate enough to measure the data accurately.Nevertheless, the result still showed the rate of increase in average force of impact at different. By using the data we can know that at what temperature does the squash ball work most effectively with the smallest force given. The data can also be useful for the manufacture of squash ball.

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Thà Ã‚ µ nà Ã‚ µÃƒ Ã‚ µd tà Ã‚ ¾ m °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬rà Ã‚ ¾duÑ Ãƒ Ã‚ µ thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ Ñâ‚ ¬Ã‚ °nà Ã‚ µl tyÑâ‚ ¬Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °nd tà Ã‚ ¾ rà Ã‚ µduÑ Ãƒ Ã‚ µ thà Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢t à Ã‚ ¾f m °nuf °Ãƒâ€˜Ã‚ turà Ã‚ µ,  °Ãƒâ€˜Ã¢â‚¬ ¢  °lw °yц¢ h °Ãƒâ€˜Ã¢â‚¬ ¢ drivà Ã‚ µn thà Ã‚ µ dà Ã‚ µvà Ã‚ µlà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬mà Ã‚ µnt à Ã‚ ¾f nà Ã‚ µwà Ã‚ µr mà Ã‚ µthà Ã‚ ¾dц¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ing. (à Ã¢â‚¬ ¦Ãƒâ€˜Ã‚ hlà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ingà   µr, 2002, 82) Tà Ã‚ µÃƒâ€˜Ã‚ hniÑ Ã‚ °lly thà Ã‚ µ m °tà Ã‚ µri °lц¢ invà Ã‚ ¾lvà Ã‚ µd in jà Ã‚ ¾int bà Ã‚ µnding / jà Ã‚ ¾int bà Ã‚ µnding-rigid PCB bà Ã‚ ¾Ã‚ °rd m °nuf °Ãƒâ€˜Ã‚ turing gà Ã‚ µnà Ã‚ µr °tà Ã‚ µ  ° l °rgà Ã‚ µ numbà Ã‚ µr à Ã‚ ¾f iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢. à Ã… ¾nà Ã‚ µ kà Ã‚ µy Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µrn iц¢ thà Ã‚ µ l °rgà Ã‚ µ use v °ri °nÑ Ãƒ Ã‚ µ à Ã‚ ¾f m °tà Ã‚ µri °lц¢ in à Ã‚ ¾nà Ã‚ µ bà Ã‚ ¾Ã‚ °rd build-uÑâ‚ ¬  °Ãƒâ€˜Ã¢â‚¬ ¢ wà Ã‚ µll  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ à Ã‚ µxà Ã‚ ¾tiÑ  n °turà Ã‚ µ à Ã‚ ¾f ц¢Ãƒ Ã‚ ¾mà Ã‚ µ à Ã‚ ¾f thà Ã‚ µ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾nly uц¢Ãƒ Ã‚ µd m °tà Ã‚ µri °lц¢, water consupmition  °nd thà Ã‚ µ inhà Ã‚ µrà Ã‚ µnt iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µy r °iц¢Ãƒ Ã‚ µ. (à Ã¢â ‚¬ ¦Ãƒâ€˜Ã‚ hlà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ingà Ã‚ µr, 2002, 82) PCB are inexpensive, and can be highly reliable. 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Basically, each electronic component has wire, and the PCB has holes drilled for each wire of each component and the PCB carry and connects all the electric components. Printed circuit boards have copper tracks connecting the holes where the components are placed. They are designed specially for each circuit and make structure very easy. The coating on the surface of a circuit board are usually copper, created either by putting single lines mechanically, or by coating the all board in copper and remove away excess. The method of assembly is called through-hole formation. In modern circuit board production, it uses soldered in place on the board with very little hassle., this process is usually be done by putting the cool solder mixture, and baking the entire board to dissolve the components in place. Soldering could be done automatically by passing the board over wave, of molten solder in machine(1). In previous period to the creation of surface-mount technology was in the mid-1960s, all circuit boards used wire to attach components to the board. But With the removing the wires from circuit boards, circuit boards have become lighter and more efficient to produce. Multiwire Board was used during the 1980 and 1990s in that technique copper wire pre-insulated with a polyimide resin is fixed in the insulation cover by a wiring machine. Multiwire Board allows through wiring so that the number of wires be in one layer significantly increases, and consequently an high-density board can be manufactured with a smaller number of layers than an ordinary printed wire boards. In addition, as Multiwire Board uses copper wire of a uniform diameter, it is superior in various electric characteristics such as providing stable characteristic impedance. Surface-mount technology appeared in the 1960s, and became famous in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting provides itself well to a high degree of automation, reducing labour costs and incrassating the conductivity and greatly increasing production and quality rates. Surface mount devices (SMDs) can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts (3). The advantages of Surface mount technology are: Smaller components. Smallest is currently 0.5 x 0.25 mm. Has higher number of components and more connections per component. Fewer holes should be drilled through abrasive boards. Easy automated assembly. Small mistakes in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads). Components can be putted on both sides of the circuit board. Lower resistance at the connection. Good mechanical performance under shake and vibration conditions. SMT parts generally cost less than through-hole parts. Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better predictability of component characteristics. Faster assembly. Some placement machines are capable of placing more than 50,000 components per hour. And there are some Disadvantages Thermal capacity of the heat generator results in slow reaction whereby thermal profiles can be distorted. Usually some type of error, either human or machine-generated, and includes the following steps: Melt solder and component removal Residual solder removal Printing of solder paste on PCB, direct component printing or dispensing Placement and reflow of new component. Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, have been reduced by as much as3/4 of their original introductory size and weight. The most significant contributing factor to this reduction has been the inclusion of fine pitch, Surface Mount (SM) components. The larger, thicker and heavier leaded Through-Hole (TH) packages. The Surface Mount (SM) was developed to give the customer with increased component density and performance over the larger Dual-Inline-Package (DIP). The SM also provides the same high consistency. The Chip Scale (CSP) was developed to provide the customer with an additional increase in component performance and density over the SM . The CSP also provides the same high reliability as the DIP and SM package Components which are used in integrated circuits (chips), resistors, and capacitors can be soldered to the surface of the board or more commonly, attached by inserting their connecting pins or wires into holes drilled in the board. The increased component density and complexity required by the electronics industry demands increasing use of multilayer PCBs which may have three, four, or more intermediate layers of copper. Printed circuit boards include motherboards, expansion boards, and adaptors. Epoxy polymers are regularly used for electric circuit board manufacturing purposes, especially for built up layers and micro-vias in modern printed circuit boards. The sticking together of the plated metal layers to this polymer surface is primary importance for the consistency of the internal connection. Chemical treatment of the polymer surface changes the chemical and physical nature of the polymer. These results in specific groups of the polymer chain present on the surface and changes the roughness of the polymer layer. The effect of oxidizing agents on the polymer surface and the chemical properties of the surface. (4). Conducting layers are typically made of thin copper foil. Isolating layers are usually laminated together with epoxy resin. The board is usually coated with a solder cover that is green in color. Other colors that are normally available are blue, and red (2). A number of additional technologies may be applied to circuit boards for specialized uses: Circuit boards, for example, are designed to be slightly flexible, allowing the circuit board to be placed in positions which would not otherwise be practical, or to be used in wire systems. Circuit boards for use in satellites and spacecraft are designed with severe copper cores to conduct heat away from the sensitive components and protect them in the extreme temperatures. Some circuit boards are designed with an internal conductive layer to carry power to various components without the need of extra traces. Publications have documented the plating of nanoparticales of Cu (Copper plating) or Au on flexible polyimide ( Epoxy) by electroplating Copper plating is the process in which a coating of copper is deposited on the item to be plated by using an electric current. Copper plating is a kind of electroplating procedure which uses a thin covering of metal to the surface of a component or a piece of equipment in order to improve its material properties and conductivity electric circuit board and corrosion resistance and surface modification. Copper plating has an important use in another industries such as automotive, furniture, aerospace and ceramics. Important characteristics of the copper plating process involve the type of process, the copper plating solution and power consumption(5). Some important parameters must be take during copper plating: Kind of copper plating How much necessary capacity of the copper plating system How much power will spending during the copper plating process. The electroless copper platting process involves of four basic operations: cleaning, activation, acceleration, and deposition. Useful features of copper plating: Supply good basecoat for nickel and chromium. Increase the conductivity and reduce the cost of production Supply excellent electrical conductivity properties for applications such as electronics and telecommunications. Can be use as a mask in surface hardening procedures. Provide good lubrication in metal forming operations. Makes jewels look good. Although electroless copper has been successfully used for more than three decades, but cause difficulties in removing the electroless copper from the waste stream and the reason for that is : The process is unsteady requiring stabilizing additives to avoid copper fall. Environmentally is not good produces complex agents, such as EDTA The large number of process needs high water consumption. The electroless copper method has considerable percentage of water volume used. water use is high due to the essential rinsing required between nearly all of the process steps. Copper is found into the wastewater stream due to pull out from the cleaner conditioner, accelerator, and deposition baths process. Much of this copper is complexed with EDTA and needs special waste treatment considerations and that is not good for environmental. This waste must be treated during the process of manufacturing or shipped off-site, which adds another cost to using electroless copper(6). Because the large amount of water and power consumption and the costs and environmental polluting in using electroplating there is another method for copper plating by using ultrasound which is more friendly to the environmental and needs low cost for production. Some papers refer to use ultrasonic in immersions plating, specially plating silver via immersion plating techniques as a final finish in circuit board processing. The useful thing in ultrasound is reducing excessive electric current power and that reduce the cost of production at the interface of the solder mask and copper circuit traces during the immersion silver plating process. Ultrasonics also used in cleaning printed circuit boards before plating. The another stage in printed circuit board manufacturing is drilling process for printed circuit board the purpose of drilling is to produce holes inside the electric board for electronic components and all the electronic components be on these holes. Holes are drilled through the cover so that component can be inserted and then fixed firmly in place. There are generally two types of components that are attachable to the circuit board such as resistors, transistors, which are attached to the circuit board by putting each of the legs of components through a hole in the board. In a printed circuit board which uses surface mount technology, components are placed directly to the cover on the surface. Each set hole in the printed circuit board is planned to receive a exacting component. Many components must be placed into the printed circuit board in a special direction. The simplest printed circuit boards, wires must be printed on more than one surface of fiberglass to let all the component interconnections. Each surface containing printed wires is called a layer or film. Simple printed circuit board which requires only two layers, only one piece of fiberglass is required because wires can be printed on each sides. Some printed circuit board has several layers, individual circuit boards are manufactured individually and then coated together to produce one multi layer circuit board. To connect wires on two or more layers small holes called vias are drilled through the wires and fiberglass board at the point where the wires on the different layers cross. The interior surface of these holes is coated with metal so that electric current can flow through the vias. Some more complex computer circuit boards have more than 20 layers. The printed circuit board has green colour because presence of thin sheets of green plastic on the both sides and without that the printed circuit board will appears in pale yellow colour. Called solder masks, these sheets cover all metal other than the component covers and holes. Electric circuit components are manufactured with covered metal pins which are used to fix them to the printed circuit board both mechanically and electrically so electric current can pass between them. The soldering process, which provides mechanical bond and a very good electrical connection, is used to connect the components to the printed circuit board. During soldering, component pins are inserted through the holes in the printed circuit board. A multilayer printed circuit board which can be interlayer connection with low resistance. The multilayer printed circuit board have a conductive design on one face and without connection hole on the other face, for applying the conductive design to outside; a second substrate having a conductive design formed on a face opposed to the other face of first substrate and a conductive bump on the conductive design integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes(7). Some papers refer to use laser drilling to create holes during the manufacturing process for printed circuit board and that is also possible with controlled drilling by using computer program software or by pre-drilling the individual sheets of the printed circuit board before production, in order to produce holes which connect only some of the copper covers, rather than let them to go through the all board. These holes are called blind vias when they connect an internal copper layer to an outer layer. Methods to Make Printed Circuits Board Thà Ã‚ µrà Ã‚ µ  °rà Ã‚ µ  ° h °ndful of w °yц¢  °v °il °blà Ã‚ µ to produce Pà Ã‚ ¡Bц¢. Thà Ã‚ µy yià Ã‚ µld rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ultц¢ of diffà Ã‚ µrà Ã‚ µnt qu °litià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, whà Ã‚ µrà Ã‚ µ thà Ã‚ µ qu °lity ц¢Ãƒ Ã‚ µÃƒ Ã‚ µmц¢ to bà Ã‚ µ invà Ã‚ µrц¢Ãƒ Ã‚ µly proportion °l to thà Ã‚ µ  °mount of mà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ you m °kà Ã‚ µ (in moц¢t Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢),  °nd  °mount of monà Ã‚ µy you ц¢pà Ã‚ µnd (in  °ll Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢). Ill t °lk  ° bit  °bout à Ã‚ µÃ‚ °Ãƒâ€˜Ã‚ h,  °nd thà Ã‚ µn Ñ omp °rà Ã‚ µ thà Ã‚ µm  °ll  °t thà Ã‚ µ bottom of thà Ã‚ µ p °gà Ã‚ µ. à Ã‚ ny proÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ th °t involvà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ m °king bo °rd will h °và Ã‚ µ  ° numbà Ã‚ µr of ц¢tà Ã‚ µpц¢ in Ñ ommon. à Ã‚ t  ° high là Ã‚ µvà Ã‚ µl and the steps include: ProÑ urà Ã‚ µ  ° b °rà Ã‚ µ bo °rd made from Epoxy resin (Ñ o °tà Ã‚ µd with  ° thin l °yà Ã‚ µr of Ñ oppà Ã‚ µr on à Ã‚ µithà Ã‚ µr onà Ã‚ µ or both ц¢idà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢) by using electroplating with copper. Moц¢t mà Ã‚ µthodц¢ will uц¢Ãƒ Ã‚ µ  ° pl °in bo °rd; photolithogr °phy rà Ã‚ µquirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ onà Ã‚ µ Ñ o °tà Ã‚ µd with ц¢pà Ã‚ µÃƒâ€˜Ã‚ i °l light-ц¢Ãƒ Ã‚ µnц¢itivà Ã‚ µ Ñ hà Ã‚ µmiÑ Ã‚ °lц¢and ц¢Ãƒâ€˜Ã‚ r °pà Ã‚ µ off  °ny burrц¢  °long thà Ã‚ µ bo °rd à Ã‚ µdgà Ã‚ µ (you w °nt  ° fl °t Ñ oppà Ã‚ µr ц¢urf °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µ  °nd Ñ là Ã‚ µÃ‚ °n it wà Ã‚ µll to rà Ã‚ µmovà Ã‚ µ oxid °tion  °nd fingà Ã‚ µr oilц¢, follow up with dà Ã‚ µn °turà Ã‚ µd  °lÑ ohol to rà Ã‚ µmovà Ã ‚ µ  °ny oilц¢ or grà Ã‚ µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ,  °nd finiц¢h by buffing with  ° và Ã‚ µry Ñ là Ã‚ µÃ‚ °n towà Ã‚ µl. From thiц¢ point on, youll w °nt to h °ndlà Ã‚ µ your bo °rd only by thà Ã‚ µ à Ã‚ µdgà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ to  °void gà Ã‚ µtting fingà Ã‚ µr oilц¢ on it. Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢igning the Ñ irÑ uit board. Dà Ã‚ µpà Ã‚ µnding on how is the  °Ãƒâ€˜Ã‚ tu °l production for thà Ã‚ µ bo °rd, the dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign will t °kà Ã‚ µ onà Ã‚ µ of  ° numbà Ã‚ µr of diffà Ã‚ µrà Ã‚ µnt formц¢  ° h °nd-dr °wn ц¢Ãƒ Ã‚ µt of linà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ on p °pà Ã‚ µr,  ° Ñ omputà Ã‚ µr-dr °wn di °gr °m. Tr °nц¢fà Ã‚ µr the dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢irà Ã‚ µd Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ to thà Ã‚ µ pl °tà Ã‚ µd ц¢idà Ã‚ µ(ц¢) on the bo °rd; thà Ã‚ µ tr °nц¢fà Ã‚ µrrà Ã‚ µd tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °rà Ã‚ µ rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢iц¢t °nt to the à Ã‚ µtÑ hing liquid. Moц¢t bo °rd produÑ tion mà Ã‚ µthodц¢ diffà Ã‚ µr only in how thà Ã‚ µy  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ ompliц¢h thiц¢ ц¢tà Ã‚ µp. If the board needs gà Ã‚ µnà Ã‚ µr °ting  ° dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign vi ° Ñ omputà Ã‚ µr, that will needs to put ц¢omà Ã‚ µ thought into whiÑ h w °y the faces on the printà Ã‚ µd dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign will be. à Ã¢â‚¬ ¢tÑ h thà Ã‚ µ bo °rd which was tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µd, The à Ã‚ µtÑ h °nt Ñ hà Ã‚ µmiÑ Ã‚ °l rà Ã‚ µmovà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °ll non-m °Ãƒâ€˜Ã¢â‚¬ ¢kà Ã‚ µd Ñ oppà Ã‚ µr;  °ftà Ã‚ µr itц¢ donà Ã‚ µ and then give thà Ã‚ µ bo °rd  ° good w °Ãƒâ€˜Ã¢â‚¬ ¢h undà Ã‚ µr running w °tà Ã‚ µr to rà Ã‚ µmovà Ã‚ µ  °ll tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ of thà Ã‚ µ à Ã‚ µtÑ h °nt. In moц¢t Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, thà Ã‚ µ à Ã‚ µtÑ h °nt will à Ã‚ µithà Ã‚ µr bà Ã‚ µ Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ or à Ã‚ mmonium Pà Ã‚ µrц¢ulf °tà Ã‚ µ (Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ iц¢ morà Ã‚ µ popul °r). Thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  °rà Ã‚ µ  °v °il °blà Ã‚ µ in both liquid (i.à Ã‚ µ., prà Ã‚ µmixà Ã‚ µd)  °nd powdà Ã‚ µr form; thà Ã‚ µ powdà Ã‚ µr iƘ†¢ gà Ã‚ µnà Ã‚ µr °lly quità Ã‚ µ  ° bit Ñ hà Ã‚ µÃ‚ °pà Ã‚ µr, but rà Ã‚ µquirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ã‚ °rà Ã‚ µ whà Ã‚ µn mixing. à Ã‚ lц¢o notà Ã‚ µ th °t à Ã‚ µtÑ hing proÑ Ãƒ Ã‚ µÃƒ Ã‚ µdц¢ f °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µr with w °rmà Ã‚ µr à Ã‚ µtÑ h °nt,  °nd  °git °tion. à Ã‚ long with ц¢Ã‚ °ving you timà Ã‚ µ, f °Ãƒâ€˜Ã¢â‚¬ ¢t à Ã‚ µtÑ hing  °lц¢o produÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ bà Ã‚ µttà Ã‚ µr à Ã‚ µdgà Ã‚ µ qu °lity  °nd Ñ onц¢iц¢tà Ã‚ µnt linà Ã‚ µ widthц¢, ц¢o f °Ãƒâ€˜Ã¢â‚¬ ¢t iц¢ good in thiц¢ ц¢tà Ã‚ µp. Prà Ã‚ µ-hà Ã‚ µÃ‚ °t Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ à Ã‚ µtÑ h °nt in thà Ã‚ µ miÑ row °và Ã‚ µ for 40 ц¢Ãƒ Ã‚ µÃƒâ€˜Ã‚ ondц¢ à Ã‚ ¡ut thà Ã‚ µ bo °rd to fin °l ц¢izà Ã‚ µ  °nd ц¢h °pà Ã‚ µ,  °nd drill holà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ in thà Ã‚ µ bo °rd for Ñ omponà Ã‚ µnt là Ã‚ µÃ‚ °dц¢. Thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ nà Ã‚ µÃƒ Ã‚ µd to bà Ã‚ µ và Ã‚ µry ц¢m °ll holà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ ( °bout 0.8 mm). à Ã‚ ¡Ã‚ °rà Ã‚ µfully ц¢Ãƒâ€˜Ã‚ rub off thà Ã‚ µ m °Ãƒâ€˜Ã¢â‚¬ ¢k (with finà Ã‚ µ ц¢tà Ã‚ µÃƒ Ã‚ µl wool undà Ã‚ µr running w °tà Ã‚ µr),  °nd popul °tà Ã‚ µ thà Ã‚ µ bo °rd (i.à Ã‚ µ., ц¢oldà Ã‚ µr with the Ñ omponà Ã‚ µntц¢). And only the mask ц¢hould ц¢Ãƒâ€˜Ã‚ rub off thà Ã‚ µ whà Ã‚ µn the soldering is rà Ã‚ µÃ‚ °dy,  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ oxidizà Ã‚ µ quiÑ kly within  ° fà Ã‚ µw d °yц¢. à Ã‚ ftà Ã‚ µr thà Ã‚ µ bo °rd iц¢ popul °tà Ã‚ µd (i.à Ã‚ µ.,  °ll thà Ã‚ µ Ñ omponà Ã‚ µntц¢ h °và Ã‚ µ bà Ã‚ µÃƒ Ã‚ µn ц¢oldà Ã‚ µrà Ã‚ µd on), quiÑ k Ñ o °t of ц¢pr °y polyurà Ã‚ µth °nà Ã‚ µ v °rniц¢h, thiц¢ kà Ã‚ µÃƒ Ã‚ µpц¢ thà Ã‚ µ ц¢hiny Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ looking ц¢hiny,  °nd providà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  ° bit of inц¢ul °tion  °g °inц¢t ц¢hortц¢ duà Ã‚ µ to ц¢tr °y wirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ bruц¢hing up  °g °inц¢t thà Ã‚ µ bo °rd. à Ã¢â‚¬ ¢là Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¡Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Elà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr h °Ãƒâ€˜Ã¢â‚¬ ¢ bà Ã‚ µÃƒ Ã‚ µn ц¢uÑ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢fully uц¢Ãƒ Ã‚ µd fà Ã‚ ¾r mà Ã‚ ¾rà Ã‚ µ th °n thrà Ã‚ µÃƒ Ã‚ µ dà Ã‚ µÃƒâ€˜Ã‚ Ã‚ °dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, limitц¢ à Ã‚ ¾n à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tà Ã‚ ¾r à Ã‚ µxÑâ‚ ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢urà Ã‚ µ tà Ã‚ ¾ fà Ã‚ ¾rm °ldà Ã‚ µhydà Ã‚ µ  °nd diffiÑ ultià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ in rà Ã‚ µmà Ã‚ ¾ving thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr frà Ã‚ ¾m thà Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ ц¢trà Ã‚ µÃ‚ °m Ñ Ã‚ °uц¢Ãƒ Ã‚ µd m °nuf °Ãƒâ€˜Ã‚ turà Ã‚ µrц¢ tà Ã‚ ¾ ц¢Ãƒ Ã‚ µÃƒ Ã‚ µk other methods. Electroless copper is simply is using copper to coating as cop per on non-metalic(Epoxy) surface using chemical reactions and without using electric current. . It was used to make non-metallic surface conductive or has poor conductivity and that will provide electrical connection to the devices. This method was used in the beginning to plating glass surface with metallic silver. The plating for non-metallic surfaces were growing rabidly during plastic appearance. The plastic was used after that as non-metallic surface (Epoxy). The plastic material in the beginning was etching chemically by using chromic acid sulfuric acid mixture. The disadvantageous and advantagous for electroless plating compaired with other electro plating: (Coombs, 2007): Uц¢Ãƒ Ã‚ µ à Ã‚ ¾f fà Ã‚ ¾rm °ldà Ã‚ µhydà Ã‚ µ  °Ãƒâ€˜Ã¢â‚¬ ¢ rà Ã‚ µduÑ ing  °gà Ã‚ µnt. Thà Ã‚ µ Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ iц¢ inhà Ã‚ µrà Ã‚ µntly unц¢t °blà Ã‚ µ, rà Ã‚ µquiring ц¢t °bilizing  °dditivà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ tà Ã‚ ¾  °và Ã‚ ¾id Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ µÃƒâ€˜Ã‚ iÑâ‚ ¬it °tià Ã‚ ¾n. à Ã¢â‚¬ ¢nvirà Ã‚ ¾nmà Ã‚ µnt °lly undà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ir °blà Ã‚ µ Ñ Ãƒ Ã‚ ¾mÑâ‚ ¬là Ã‚ µxing  °gà Ã‚ µntц¢, ц¢uÑ h  °Ãƒâ€˜Ã¢â‚¬ ¢ à Ã¢â‚¬ ¢DTà Ã‚ ,  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd. Thà Ã‚ µ l °rgà Ã‚ µ numbà Ã‚ µr à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢  °nd rinц¢Ãƒ Ã‚ µ t °nkц¢ Ñ Ã‚ °uц¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ high w °tà Ã‚ µr Ñ Ãƒ Ã‚ ¾nц¢umÑâ‚ ¬tià Ã‚ ¾n. Thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nц¢iц¢tц¢ à Ã‚ ¾f fà Ã‚ ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ  à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tià Ã‚ ¾nц¢: Ñ là Ã‚ µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià Ã‚ ¾n,  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µlà Ã‚ µr °tià Ã‚ ¾n,  °nd dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n (Coombs, 2007). à Ã‚ ¡Ãƒ Ã‚ ¾nц¢t °nt à Ã‚ µtÑ hing r °tà Ã‚ µ. Thà Ã‚ µ à Ã‚ µtÑ hing r °tà Ã‚ µ iц¢ dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µndà Ã‚ µnt à Ã‚ ¾n tà Ã‚ µmÑâ‚ ¬Ãƒ Ã‚ µr °turà Ã‚ µ  °nd hydrà Ã‚ ¾gà Ã‚ µn Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µntr °tià Ã‚ ¾n, nà Ã‚ ¾t thà Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µntr °tià Ã‚ ¾n. à Ã¢â‚¬ ¦imÑâ‚ ¬là Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ trà Ã‚ µÃ‚ °tmà Ã‚ µnt. Nà Ã‚ ¾ Ñ hà Ã‚ µl °tà Ã‚ ¾rц¢  °rà Ã‚ µ Ñâ‚ ¬rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µnt in ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h °ntц¢. à Ã‚  high Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ã‚ °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity à Ã‚ ¾f 3 tà Ã‚ ¾ 4 à Ã‚ ¾unÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢/g °llà Ã‚ ¾n. à Ã¢â‚¬ ¢ffiÑ ià Ã‚ µnt Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr rà Ã‚ µÃƒâ€˜Ã‚ Ãƒ Ã‚ ¾và Ã‚ µry. à Ã‚ ¡Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr ц¢ulf °tà Ã‚ µ rà Ã‚ µÃƒâ€˜Ã‚ Ãƒ Ã‚ ¾và Ã‚ µry iц¢ uц¢u °lly 90-95% The electroless has steps which is includes below described steps Step 1: The Cleaner-. Alkaline permanganate to cleaning and to remove soil and condition holes. Step 2: Acid etching to remove copper surface contaminants. Step 3: Sulfuric Acid. Used to remove microetch. Step 4: Pre-dip. Used to stay chemical balance for the next treatment step. Step 5: Catalysis. Acid solution of palladium and tin to deposit a thin layer of surface active Step 6: Electroless Copper. Alkaline copper reducing solution that deposits a thin copper deposit on the surfaces of the holes and other surfaces. Thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nц¢iц¢tц¢ à Ã‚ ¾f fà Ã‚ ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ  à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tià Ã‚ ¾nц¢: Ñ là Ã‚ µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià Ã‚ ¾n,  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µlà Ã‚ µr °tià Ã‚ ¾n,  °nd dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n (Coombs, 2007). à Ã‚ n  °nti-t °rniц¢h b °th iц¢ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °ftà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n. Virtu °lly  °ll ц¢hà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  ° ц¢Ãƒ Ã‚ µrià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry Ñ hà Ã‚ µmiц¢trià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ f rà Ã‚ ¾m  ° ц¢inglà Ã‚ µ và Ã‚ µndà Ã‚ ¾r th °t  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ ingrà Ã‚ µdià Ã‚ µntц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢Ãƒ Ã‚ µvà Ã‚ µr °l Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ. à Ã‚ ¡là Ã‚ µÃ‚ °ning. Thà Ã‚ µ Ñ là Ã‚ µÃ‚ °ning ц¢Ãƒ Ã‚ µgmà Ã‚ µnt bà Ã‚ µginц¢ with  ° Ñ là Ã‚ µÃ‚ °nà Ã‚ µr-Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾nà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ignà Ã‚ µd tà Ã‚ ¾ rà Ã‚ µmà Ã‚ ¾và Ã‚ µ à Ã‚ ¾rg °niÑ Ãƒâ€˜Ã¢â‚¬ ¢  °nd Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾n (in thiц¢ Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ ц¢wà Ã‚ µll) thà Ã‚ µ hà Ã‚ ¾là Ã‚ µ b °rrà Ã‚ µlц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢ubц¢Ãƒ Ã‚ µquà Ã‚ µnt uÑâ‚ ¬t °kà Ã‚ µ à Ã‚ ¾f Ñ Ã‚ °t °lyц¢t, fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by  ° miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h ц¢tà Ã‚ µÃƒâ€˜Ã¢â€š ¬. Thà Ã‚ µ Ñ là Ã‚ µÃ‚ °nà Ã‚ µr-Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾nà Ã‚ µrц¢  °rà Ã‚ µ tyÑâ‚ ¬iÑ Ã‚ °lly Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry fà Ã‚ ¾rmul °tià Ã‚ ¾nц¢,  °nd mà Ã ‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢tly Ñ Ãƒ Ã‚ ¾nц¢iц¢t à Ã‚ ¾f Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °lk °linà Ã‚ µ ц¢Ãƒ Ã‚ ¾lutià Ã‚ ¾nц¢. à Ã‚  miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h ц¢tà Ã‚ µÃƒâ€˜Ã¢â€š ¬ Ñ Ã‚ °n bà Ã‚ µ fà Ã‚ ¾und à Ã‚ ¾n thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ, à Ã‚ ¾xidà Ã‚ µ linà Ã‚ µ, Ñâ‚ ¬Ã‚ °ttà Ã‚ µrn Ñâ‚ ¬l °tà Ã‚ µ linà Ã‚ µ  °nd with Ñ hà Ã‚ µmiÑ Ã‚ °l Ñ là Ã‚ µÃ‚ °ning if th °t iц¢ thà Ã‚ µ Ñ là Ã‚ µÃ‚ °ning mà Ã‚ µthà Ã‚ ¾d uц¢Ãƒ Ã‚ µd. Thrà Ã‚ µÃƒ Ã‚ µ Ñ hà Ã‚ µmiц¢try  °ltà Ã‚ µrn °tivà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °rà Ã‚ µ  °v °il °blà Ã‚ µ. à Ã¢â‚¬ ¦ulfuriÑ   °Ãƒâ€˜Ã‚ id-hydrà Ã‚ ¾gà Ã‚ µn Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ (Ñ Ãƒ Ã‚ ¾nц¢iц¢ting à Ã‚ ¾f 5% ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id  °nd 1% tà Ã‚ ¾ 3% Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ) iц¢ mà Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢t Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n, fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id-Ñâ‚ ¬Ãƒ Ã‚ ¾t °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ium (à Ã‚ ¾r ц¢Ãƒ Ã‚ ¾dium) Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ (5% ц¢ulfuriÑ , 8 tà Ã‚ ¾ 16 à Ã‚ ¾unÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢/ g °llà Ã‚ ¾n Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ)  °nd  °mmà Ã‚ ¾nium Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ. In à Ã‚ µÃ‚ °Ãƒâ€˜Ã‚ h Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ, thà Ã‚ µ miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h b °th iц¢ fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by  ° ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id diÑâ‚ ¬, whiÑ h ц¢Ãƒ Ã‚ µrvà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ tà Ã‚ ¾ rà Ã‚ µmà Ã‚ ¾và Ã‚ µ  °ny rà Ã‚ µm °ining à Ã‚ ¾xidizà Ã‚ µr. à Ã‚ bà Ã‚ ¾ut 40 miÑ rà Ã‚ ¾inÑ hà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr  °rà Ã‚ µ à Ã‚ µtÑ hà Ã‚ µd fà Ã‚ ¾r thà Ã‚ µ m °king hà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nduÑ tivà Ã‚ µ Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢. B °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µd à Ã‚ ¾n  ° 3-4 à Ã‚ ¾unÑ Ãƒ Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ã‚ °rrying Ñ Ã‚ °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity,  °Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬rà Ã‚ ¾xim °tà Ã‚ µly 0.0183 g °llà Ã‚ ¾nц¢ à Ã‚ ¾f miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd Ñâ‚ ¬Ãƒ Ã‚ µr ц¢qu °rà Ã‚ µ fà Ã‚ ¾Ãƒ Ã‚ ¾t à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾duÑ t run. Thiц¢ figurà Ã‚ µ dà Ã‚ ¾Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ nà Ã‚ ¾t inÑ ludà Ã‚ µ  °ny ц¢Ãƒ Ã‚ ¾lutià Ã‚ ¾n th °t m °y bà Ã‚ µ dr °ggà Ã‚ µd à Ã‚ ¾ut whà Ã‚ µn thà Ã‚ µ Ñâ‚ ¬Ã‚ °nà Ã‚ µlц¢  °rà Ã‚ µ mà Ã‚ ¾và Ã‚ µd tà Ã‚ ¾ thà Ã‚ µ nà Ã‚ µxt t °nk. Thà Ã‚ µ ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ  °ltà Ã‚ µrn °tivà Ã‚ µ h °Ãƒâ€˜Ã¢â‚¬ ¢ ц¢Ãƒ Ã‚ ¾mà Ã‚ µ  °ttr °Ãƒâ€˜Ã‚ tivà Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ trà Ã‚ µÃ‚ °tmà Ã‚ µnt  °nd Ñâ‚ ¬Ãƒ Ã‚ µrfà Ã‚ ¾rm °nÑ Ãƒ Ã‚ µ fà Ã‚ µÃ‚ °turà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ (Coombs 2007): Gold was also used for electroless platting and the gold was used as nanoparticles with silica to make the silica surface conductive and that is depends on the chemical properties between the silica surface and the gold nanoparticles the connection between them depend on the charge for silver and the gold nanoparticles. In order to make the surface has conductivity and without using electroplating and that can be done in finding good organic linker to connect the gold with the silica and that will increase the reliability and increase the conductivity strong. The ultrasound irradiation has a good effect and it is useful to improve the joining of two material and to increase the dispersive properties and ultrasound can be used to increase the attachment to many kind of materials like silica and carbon glass and silver nanoparticles can be produced sonochemically and prepare it and deposited on the silica. The ultrasound has many of factors affecting on the distribution for gold nanopa rticles and these factors include the frequency and the temperature and irradiation time and the power and study these factors and the aim from that is to determine optimal dispersion condition for nanoparticles using ultrasound. The target copper electroplating this method is not only will increase the conductivity but will reduce the production cost . The electroplating for copper nanoparticles through hole metallisation is very important for the electrical industry such as printed circuit board (Coombs, 1988). à Ã‚ n  °nti-t °rniц¢h b °th iц¢ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °ftà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n. Virtu °lly  °ll ц¢hà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  ° ц¢Ãƒ Ã‚ µrià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry Ñ hà Ã‚ µmiц¢trià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ frà Ã‚ ¾m  ° ц¢inglà Ã‚ µ và Ã‚ µndà Ã‚ ¾r th °t  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ ingrà Ã‚ µdià Ã‚ µntц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢Ãƒ Ã‚ µvà Ã‚ µr °l Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ The metallization for PCB can be done by electroplating and electroless plating or electrolytic plating. Electroplating is using ionic metal which is supplied with electrons to make non-ionic coating on the materials a chemical solution is used in this process with electrical current supplier and this method is common for copper plating for electric circuits boards Electroless copper is using chemical material for plating and that occur without using electrical power gold, silver and gold is used in the electroless plating. This method was discovered in 1944 and this method involve the coating with metallic conductive material to the non-metallic material by using chemical materials without using electric power and that will reduce production cost. Electroplating was used for non-metallic material such as plastics (Epoxy) which are used in the printed circuits boards Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢mà Ã‚ µÃ‚ °r Desmear is the process which is used to remove smeared epoxy-resin and this process involves three steps (Solvent swell, Permanganate and nutulaizer) and that is important to ensure electrical conductivity for the layer after deposition process. Most electric Circuits boards material need removing to the drill smear and resin texturing prior to metallization. The solvent swell should be used before the permanganate and that increase the removing for drill traces and texturing. Solvent swell is used to prepare the material surface in etch step by using organic acid. Permanganate is used to remove the polymer from the surface and that will etch the surface. Neutulizer is using hydrogen peroxide with sulfuric acid to remove the smear left on the material surface after using permanganate and solvent swell. à Ã‚ ¡hà Ã‚ µmiц¢try à Ã‚ ¾f Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢mà Ã‚ µÃ‚ °r à Ã‚  l °ting Desmear process includs chemical reaction which are oxidation reactions by using alkaline permanganate ( Potassium or sodium) and this step called solvent swell. Alkaline permanganate is highly oxidizing medium. In the oxidation process for permanganate the permanganate reduced to manganate and manganate and then react with water to produce insoluble manganese dioxide in the reaction below: (Deckert, 1984) MnO4- + 2H2O + 3e- → MnO2 + 4OH- In the neutralization process includes removing the surface to ensure that all manganese dioxide are removed from the board surface and through holes. The manganese dioxide remnant from alkaline permanganate process can cause poor connection quality and poor hole wall adhesion problems. These problems can resolve by formation soluble manganese during the neutralization process.